Determination of bond wire failure probabilities in microelectronic packages.

MLA

Casper, Thorben, et al. “Determination of Bond Wire Failure Probabilities in Microelectronic Packages.” 2016 22nd International Workshop on Thermal Investigations of ICs & Systems (THERMINIC), Jan. 2016, pp. 39–44. EBSCOhost, https://doi.org/10.1109/THERMINIC.2016.7748645.

APA

Casper, T., Romer, U., & Schops, S. (2016). Determination of bond wire failure probabilities in microelectronic packages. 2016 22nd International Workshop on Thermal Investigations of ICs & Systems (THERMINIC), 39–44. https://doi.org/10.1109/THERMINIC.2016.7748645

Chicago

Casper, Thorben, Ulrich Romer, and Sebastian Schops. 2016. “Determination of Bond Wire Failure Probabilities in Microelectronic Packages.” 2016 22nd International Workshop on Thermal Investigations of ICs & Systems (THERMINIC), January, 39–44. doi:10.1109/THERMINIC.2016.7748645.