Coupling capacitance extraction in through-silicon via (TSV) arrays.

Authors :: Ramadan, Tarek
Yahya, Eslam
Dessouky, Mohamed
Ismail, Yehea
Source :: 2015 IEEE International Conference on Electronics, Circuits & Systems (ICECS); 2015, p470-473, 4p
Publication Year :: 2015

Language :: English
ISBNs :: 9781509002467
Database :: Complementary Index
Journal :: 2015 IEEE International Conference on Electronics, Circuits & Systems (ICECS)
Publication Type :: Conference
Accession number :: 115631703
Full Text :: https://doi.org/10.1109/ICECS.2015.7440350