Coupling capacitance extraction in through-silicon via (TSV) arrays.

MLA

Ramadan, Tarek, et al. “Coupling Capacitance Extraction in Through-Silicon via (TSV) Arrays.” 2015 IEEE International Conference on Electronics, Circuits & Systems (ICECS), Jan. 2015, pp. 470–73. EBSCOhost, https://doi.org/10.1109/ICECS.2015.7440350.

APA

Ramadan, T., Yahya, E., Dessouky, M., & Ismail, Y. (2015). Coupling capacitance extraction in through-silicon via (TSV) arrays. 2015 IEEE International Conference on Electronics, Circuits & Systems (ICECS), 470–473. https://doi.org/10.1109/ICECS.2015.7440350

Chicago

Ramadan, Tarek, Eslam Yahya, Mohamed Dessouky, and Yehea Ismail. 2015. “Coupling Capacitance Extraction in Through-Silicon via (TSV) Arrays.” 2015 IEEE International Conference on Electronics, Circuits & Systems (ICECS), January, 470–73. doi:10.1109/ICECS.2015.7440350.