Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni.

Highlights: [•] This work investigates the effect of (0.05–0.1wt.%) Ni additions on the SAC (0507) solder. [•] Enhanced strength of SAC (0507)–0.05Ni was due to microstructural refinement and uniform distribution of the IMCs. [•] Improved ductility and worsen mechanical properties of SAC (0507)–0.1Ni alloy were due to the presence of large β-Sn grains. [•] Both YS and UTS increased with and decreasing temperature and decreasing strain rate. [ABSTRACT FROM AUTHOR]