Cite

Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni.

MLA

Hammad, A. E. “Investigation of Microstructure and Mechanical Properties of Novel Sn–0.5Ag–0.7Cu Solders Containing Small Amount of Ni.” Materials & Design, vol. 50, Sept. 2013, pp. 108–16. EBSCOhost, https://doi.org/10.1016/j.matdes.2013.03.010.



APA

Hammad, A. E. (2013). Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni. Materials & Design, 50, 108–116. https://doi.org/10.1016/j.matdes.2013.03.010



Chicago

Hammad, A.E. 2013. “Investigation of Microstructure and Mechanical Properties of Novel Sn–0.5Ag–0.7Cu Solders Containing Small Amount of Ni.” Materials & Design 50 (September): 108–16. doi:10.1016/j.matdes.2013.03.010.