Modelling roughness, grain and confinement effects on transport in embedded metallic films

Roughness and grain effects in nanowires or oxide-embedded damascene ULSI structures are modelled using a pseudo-Monte Carlo carrier particle optics (CPO) method [MRS Advanced Metallization Conference for ULSI applications (AMC 2001) (2002) 371], matching experimental data on aluminum and platinum films and electrodeposited copper wire. Diffuse scatter from rough and specular scatter from uneven geometric surfaces is considered. Diffusive results accord with Sambles and Elsom [J. Phys. F 11 (1981) 647; J. Phys. F 10 (1980) 1487], matching temperature-dependent resistivities in very thin films more closely than Fuchs and Sondheimer [Proc. Cambridge Phil. Soc. 34 (1938) 100; Adv. Phys. 1 (1952) 1]. Grain profile effects improve the model of resistance increase in embedded structures, suggesting directions for improving conduction through enlarged grain cross-section. [Copyright &y& Elsevier]