Modelling roughness, grain and confinement effects on transport in embedded metallic films

MLA

Knight, Gary D., and Tom Smy. “Modelling Roughness, Grain and Confinement Effects on Transport in Embedded Metallic Films.” Microelectronic Engineering, vol. 64, no. 1–4, Oct. 2002, p. 417. EBSCOhost, https://doi.org/10.1016/S0167-9317(02)00816-X.

APA

Knight, G. D., & Smy, T. (2002). Modelling roughness, grain and confinement effects on transport in embedded metallic films. Microelectronic Engineering, 64(1–4), 417. https://doi.org/10.1016/S0167-9317(02)00816-X

Chicago

Knight, Gary D., and Tom Smy. 2002. “Modelling Roughness, Grain and Confinement Effects on Transport in Embedded Metallic Films.” Microelectronic Engineering 64 (1–4): 417. doi:10.1016/S0167-9317(02)00816-X.