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Direct evidence of fcc-type miscibility gap in the Cu–Ni–V system at high temperatures
- Source :
-
Materials Letters . Jan2011, Vol. 65 Issue 2, p247-249. 3p. - Publication Year :
- 2011
-
Abstract
- Abstract: This work firstly presents detailed evidence of the fcc-type miscibility gap in the Cu–Ni–V system at temperatures between 1000°C and 1100°C. The phase equilibria, phase transformation behavior and microhardness of the (Cu0.5Ni0.5)100−xVx (at.%) (x=2, 4, 6, 8, 10, 12) alloys have been investigated by electron probe microanalysis, X-ray diffraction, differential scanning calorimetry and Vickers hardness tester, confirming that the fcc-type miscibility gap exists in the Cu–Ni–V system at temperatures between 1000°C and 1100°C. The obtained results will not only help to well understand the strengthening mechanisms in the Cu–Ni–V alloys at high temperatures, but also to effectively develop new high-temperature spinodal-hardened Cu–Ni–V base alloys in the future. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 0167577X
- Volume :
- 65
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- Materials Letters
- Publication Type :
- Academic Journal
- Accession number :
- 55617383
- Full Text :
- https://doi.org/10.1016/j.matlet.2010.09.083