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Direct evidence of fcc-type miscibility gap in the Cu–Ni–V system at high temperatures

Authors :
Yu, Yan
Wang, Cuiping
Liu, Xingjun
Kainuma, Ryosuke
Ishida, Kiyohito
Source :
Materials Letters. Jan2011, Vol. 65 Issue 2, p247-249. 3p.
Publication Year :
2011

Abstract

Abstract: This work firstly presents detailed evidence of the fcc-type miscibility gap in the Cu–Ni–V system at temperatures between 1000°C and 1100°C. The phase equilibria, phase transformation behavior and microhardness of the (Cu0.5Ni0.5)100−xVx (at.%) (x=2, 4, 6, 8, 10, 12) alloys have been investigated by electron probe microanalysis, X-ray diffraction, differential scanning calorimetry and Vickers hardness tester, confirming that the fcc-type miscibility gap exists in the Cu–Ni–V system at temperatures between 1000°C and 1100°C. The obtained results will not only help to well understand the strengthening mechanisms in the Cu–Ni–V alloys at high temperatures, but also to effectively develop new high-temperature spinodal-hardened Cu–Ni–V base alloys in the future. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
0167577X
Volume :
65
Issue :
2
Database :
Academic Search Index
Journal :
Materials Letters
Publication Type :
Academic Journal
Accession number :
55617383
Full Text :
https://doi.org/10.1016/j.matlet.2010.09.083