Direct evidence of fcc-type miscibility gap in the Cu–Ni–V system at high temperatures

MLA

Yu, Yan, et al. “Direct Evidence of Fcc-Type Miscibility Gap in the Cu–Ni–V System at High Temperatures.” Materials Letters, vol. 65, no. 2, Jan. 2011, pp. 247–49. EBSCOhost, https://doi.org/10.1016/j.matlet.2010.09.083.

APA

Yu, Y., Wang, C., Liu, X., Kainuma, R., & Ishida, K. (2011). Direct evidence of fcc-type miscibility gap in the Cu–Ni–V system at high temperatures. Materials Letters, 65(2), 247–249. https://doi.org/10.1016/j.matlet.2010.09.083

Chicago

Yu, Yan, Cuiping Wang, Xingjun Liu, Ryosuke Kainuma, and Kiyohito Ishida. 2011. “Direct Evidence of Fcc-Type Miscibility Gap in the Cu–Ni–V System at High Temperatures.” Materials Letters 65 (2): 247–49. doi:10.1016/j.matlet.2010.09.083.