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Silver Metallization for Advanced Interconnects.
- Source :
-
IEEE Transactions on Advanced Packaging . Feb99, Vol. 22 Issue 1, p4. 5p. 3 Black and White Photographs, 1 Diagram, 2 Charts, 5 Graphs. - Publication Year :
- 1999
-
Abstract
- Presents information on a study which examined the reliability of silver and the potential benefits of silver metallization in terms of future trends in microelectronic interconnections. Mechanical and electrical benefits of silver; Reliability test of the corrosion threshold voltage of silver; Experimental details; Results and discussion; Conclusions.
- Subjects :
- *SILVER
*MICROELECTRONICS
Subjects
Details
- Language :
- English
- ISSN :
- 15213323
- Volume :
- 22
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Advanced Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 3043178
- Full Text :
- https://doi.org/10.1109/6040.746536