Cite
Silver Metallization for Advanced Interconnects.
MLA
Manepalli, Rahul, and Frank Stepniak. “Silver Metallization for Advanced Interconnects.” IEEE Transactions on Advanced Packaging, vol. 22, no. 1, Feb. 1999, p. 4. EBSCOhost, https://doi.org/10.1109/6040.746536.
APA
Manepalli, R., & Stepniak, F. (1999). Silver Metallization for Advanced Interconnects. IEEE Transactions on Advanced Packaging, 22(1), 4. https://doi.org/10.1109/6040.746536
Chicago
Manepalli, Rahul, and Frank Stepniak. 1999. “Silver Metallization for Advanced Interconnects.” IEEE Transactions on Advanced Packaging 22 (1): 4. doi:10.1109/6040.746536.