PROCESSOR DESIGN IN 3D DIE-STACKING TECHNOLOGIES.

The article presents an overview on the emergence of three-dimensional (ED) integration in the fabrication technology and its impact on processor design. It also presents various case studies on different approaches in designing (3D) multicore system and single-core processors and discusses the significance of technological innovations in creating future high-performance microprocessors. It offers an overview on 3D die-stacking integration, a new fabrication technology that stacks multiple layers of processed silicon with a very high-density, low-latency layer-to-layer interconnect.