Effect of Ti on TLP bonding of SiCp/2618Al composites using interlayers of mixed Al–Ag–Cu system powders.

Transient liquid phase diffusion bonding of SiC particulate reinforced 2618 aluminium alloy matrix composite (SiCp/2618Al MMC) was carried out by using interlayers of mixed Al–Ag–Cu and Al–Ag–Cu–Ti powders. The effects of Ti on formation, microstructure and properties of the joints were investigated. The results show that adding a certain amount of Ti can obviously improve the TLP bonding quality of SiCp/2618Al MMC by using an Al–Ag–Cu interlayer with the eutectic composition. Besides improving the wettability of Al–Ag–Cu eutectic liquid to surfaces of the parent materials during bonding, the Ti added into interlayers has an effect of shortening the solidification time of the joining layer, thus decreasing SiC particles from the parent materials entering into the joining layer. The joints bonded using Al–Ag–Cu–Ti interlayers have a maximum shear strength of 101 MPa when 2·1%Ti is added. [ABSTRACT FROM AUTHOR]