Cite
Effect of Ti on TLP bonding of SiCp/2618Al composites using interlayers of mixed Al–Ag–Cu system powders.
MLA
Huang, J. H., et al. “Effect of Ti on TLP Bonding of SiCp/2618Al Composites Using Interlayers of Mixed Al–Ag–Cu System Powders.” Materials Science & Technology, vol. 23, no. 1, Jan. 2007, pp. 87–91. EBSCOhost, https://doi.org/10.1179/174328407X158460.
APA
Huang, J. H., Wan, Y., Zhao, H. T., Cheng, D. H., & Zhang, H. (2007). Effect of Ti on TLP bonding of SiCp/2618Al composites using interlayers of mixed Al–Ag–Cu system powders. Materials Science & Technology, 23(1), 87–91. https://doi.org/10.1179/174328407X158460
Chicago
Huang, J. H., Y. Wan, H. T. Zhao, D. H. Cheng, and H. Zhang. 2007. “Effect of Ti on TLP Bonding of SiCp/2618Al Composites Using Interlayers of Mixed Al–Ag–Cu System Powders.” Materials Science & Technology 23 (1): 87–91. doi:10.1179/174328407X158460.