Wide-field pattern-inspection system cuts microscopy scan time.

Reports on the development of a wide-field pattern inspection system that cuts the time needed to check an entire exposure shot for defects by NanoGeometry Research Inc. and Topcorn Corp. in Japan. Ability of the high-resolution scanning electron microscopy (SEM) system in comparing the pattern on the wafer to the design layout and flags and analyzes the defects; Function of the newly developed e-beam SEM inspection technology to enlarge the field of view; Specification of the types of circuit patterns to be measured by the operator.