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Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning.

Authors :
Edwards, Chris
Vaske, Alex
McDaniel, Nathan
Pradhan, Dipali
Panda, Debashis
Source :
IEEE Transactions on Semiconductor Manufacturing. Aug2023, Vol. 36 Issue 3, p332-339. 8p.
Publication Year :
2023

Abstract

We present our automated real-time socket inspection system capable of detecting an assortment of defects including metallic and liquid staining, loose capacitors and pins, and other debris and foreign material (FM). Our test tools pick and place manufactured units into sockets for electrical testing. Any debris accumulated inside the test sockets will likely damage subsequent units until the defective socket is replaced. To quickly capture in-situ defects and mitigate further damage, we equipped each pick-and-place arm with a new vision system designed to fit within the existing tool. The tight footprint constraints required a highly compact imaging system which resulted in a variety of image artifacts, creating several unique challenges. Our inspection algorithm utilizes a variety of advanced computer vision and machine learning techniques to normalize images, extract and match features, register the images, suppress unwanted artifacts, and detect defects. The detected changes are then sent to a deep learning classifier to further filter between true defects and natural socket deterioration. The flagged socket images can be manually dispositioned by the user and the socket can be sent for repair or cleaning as needed. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
08946507
Volume :
36
Issue :
3
Database :
Academic Search Index
Journal :
IEEE Transactions on Semiconductor Manufacturing
Publication Type :
Academic Journal
Accession number :
170043068
Full Text :
https://doi.org/10.1109/TSM.2023.3273175