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Upconversion semiconductor interfaces by wafer bonding for photovoltaic applications.

Authors :
Sano, Naoki
Nishigaya, Kosuke
Tanabe, Katsuaki
Source :
Applied Physics Letters. 7/4/2022, Vol. 121 Issue 1, p1-6. 6p.
Publication Year :
2022

Abstract

Efficient use of incident sunlight is an important key issue for the improvement of solar cell performance. Here, we propose and experimentally demonstrate photon upconversion material mediated semiconductor bonding as a concept of interfacial functionalization. Our wavelength-converting semiconductor interface comprises rare earth doped upconversion nanoparticles embedded in a hydrogel matrix. Advantageously, the bonding process is conducted at room temperature in ambient air. As a proof of principle, photocurrent enhancement in bonded Si solar cells is demonstrated. Our technical scheme could be useful to improve the performance and structural flexibility of various optoelectronic devices by delivering the preferred frequency to each of the optical components. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00036951
Volume :
121
Issue :
1
Database :
Academic Search Index
Journal :
Applied Physics Letters
Publication Type :
Academic Journal
Accession number :
157890618
Full Text :
https://doi.org/10.1063/5.0097427