Cite
Upconversion semiconductor interfaces by wafer bonding for photovoltaic applications.
MLA
Sano, Naoki, et al. “Upconversion Semiconductor Interfaces by Wafer Bonding for Photovoltaic Applications.” Applied Physics Letters, vol. 121, no. 1, July 2022, pp. 1–6. EBSCOhost, https://doi.org/10.1063/5.0097427.
APA
Sano, N., Nishigaya, K., & Tanabe, K. (2022). Upconversion semiconductor interfaces by wafer bonding for photovoltaic applications. Applied Physics Letters, 121(1), 1–6. https://doi.org/10.1063/5.0097427
Chicago
Sano, Naoki, Kosuke Nishigaya, and Katsuaki Tanabe. 2022. “Upconversion Semiconductor Interfaces by Wafer Bonding for Photovoltaic Applications.” Applied Physics Letters 121 (1): 1–6. doi:10.1063/5.0097427.