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Challenges and Opportunities for Thermal Management of Information and Communications Technologies Equipment: A Telecommunications Perspective.

Authors :
Salamon, Todd R.
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Aug2017, Vol. 7 Issue 8, p1212-1227. 16p.
Publication Year :
2017

Abstract

This paper discusses challenges and opportunities for thermal management of information and communications technologies equipment, with a particular focus on telecommunications equipment. This paper identifies the key drivers for network traffic growth and how these increasing traffic demands are driving innovations in telecommunications, requiring the development of new and novel thermal management technologies to meet the product performance and reliability requirements. Application areas discussed include photonics, wireless networking, extreme heat density applications, and liquid cooling, with spatial scales ranging from individual transistors up to data center and telecom central offices. A perspective on the anticipated technology trends, key technical challenges, and opportunities for innovation and impact is also presented. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
7
Issue :
8
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
124750342
Full Text :
https://doi.org/10.1109/TCPMT.2016.2642051