Challenges and Opportunities for Thermal Management of Information and Communications Technologies Equipment: A Telecommunications Perspective.

MLA

Salamon, Todd R. “Challenges and Opportunities for Thermal Management of Information and Communications Technologies Equipment: A Telecommunications Perspective.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 7, no. 8, Aug. 2017, pp. 1212–27. EBSCOhost, https://doi.org/10.1109/TCPMT.2016.2642051.

APA

Salamon, T. R. (2017). Challenges and Opportunities for Thermal Management of Information and Communications Technologies Equipment: A Telecommunications Perspective. IEEE Transactions on Components, Packaging & Manufacturing Technology, 7(8), 1212–1227. https://doi.org/10.1109/TCPMT.2016.2642051

Chicago

Salamon, Todd R. 2017. “Challenges and Opportunities for Thermal Management of Information and Communications Technologies Equipment: A Telecommunications Perspective.” IEEE Transactions on Components, Packaging & Manufacturing Technology 7 (8): 1212–27. doi:10.1109/TCPMT.2016.2642051.