76 results on '"van Dijk, Leon"'
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2. Dense mask registration fingerprint characterization to better understand and mitigate the metrology to device offset
3. New technique for measuring free-form wafer shape for feed-forward overlay corrections
4. Track integrated backside cleaning solution: impact of backside contamination on printing distortions
5. Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations
6. Die-level nano-topography metrology to characterize the stress-induced in-plane distortion contribution to overlay
7. New technique for measuring free-form wafer shape to enable wafer distortion predictions
8. Dense mask registration fingerprint characterization to better understand and mitigate the metrology to device offset
9. Direct correlation between mask registration and on-wafer measurements for individual logic device features
10. Mitigation of the etch-induced intra-field overlay contribution
11. Computational overlay as enabler for enhanced on-product overlay control
12. Theory of exciton dynamics in molecular aggregates in presence of polaronic effects
13. Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations
14. Theoretical study of fluorescence of self-assembling helical supramolecular aggregates
15. Direct correlation between mask registration and on-wafer measurements for individual logic device features
16. On product overlay characterization after stressed layer etch
17. Excursion detection and root-cause analysis using virtual overlay metrology
18. The mask contribution as part of the intra-field on-product overlay performance
19. Towards Excursion Detection for Implant Layers based on Virtual Overlay Metrology
20. Intra-field etch induced overlay penalties
21. Macrochannelling: Characterisation of nano-structures by ion beam analysis
22. Mitigation of the etch-induced intra-field overlay contribution
23. Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding
24. Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
25. Detection and mitigation of furnace anneal induced distortions at the wafer edge
26. The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
27. Intra-field stress impact on global wafer deformation
28. Smart implant-layer overlay metrology to enable fab cycle time reduction
29. Dense mask registration fingerprint characterization to better understand and mitigate the metrology to device offset.
30. New technique for measuring free-form wafer shape to enable wafer distortion predictions.
31. Towards fab cycle time reduction by machine learning-based overlay metrology
32. Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
33. Wafer edge overlay control solution for N7 and beyond
34. The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay.
35. Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance.
36. Intra-field stress impact on global wafer deformation.
37. Smart implant-layer overlay metrology to enable fab cycle time reduction.
38. Off-line mask-to-mask registration characterization as enabler for computational overlay
39. On-product overlay characterization after stressed layer etch
40. Optical spectra and stokes shift in double-stranded helical supramolecular assemblies
41. Photoluminescence spectra of self-assembling helical supramolecular assemblies: a theoretical study
42. Wafer-shape based in-plane distortion predictions using Superfast 4G metrology
43. Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution.
44. Towards Fab Cycle Time Reduction by Machine Learning based Overlay Metrology.
45. Wafer edge overlay control solution for N7 and beyond.
46. The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
47. Intra-field stress impact on global wafer deformation
48. Smart implant-layer overlay metrology to enable fab cycle time reduction
49. Towards fab cycle time reduction by machine learning-based overlay metrology
50. Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
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