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The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
- Source :
- Proceedings of SPIE; June 2019, Vol. 11178 Issue: 1 p111780R-111780R-12, 11066233p
- Publication Year :
- 2019
Details
- Language :
- English
- ISSN :
- 0277786X
- Volume :
- 11178
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Proceedings of SPIE
- Publication Type :
- Periodical
- Accession number :
- ejs50636260
- Full Text :
- https://doi.org/10.1117/12.2535900