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Defect control is crucial in the Czochralski (CZ) process for producing high-quality silicon crystals used in microelectronic devices. This study introduces a novel "top cooling" method to minimize defects during crystal growth. The top cooling system, integrated with the CZ puller, enhances thermal uniformity and temperature gradients at the solid–liquid interface. Experimental analysis using laser particle counting on silicon wafers shows a significant reduction in defects, particularly in the upper regions of the ingot, with decreases of up to 92% for defects larger than 60 nm. Simulations using the 3D finite element method confirm the impact of top cooling on point defect concentration, showing a notable reduction in both vacancy- and interstitial-type defects. These findings demonstrate that top cooling is an effective technique for defect reduction, improving silicon crystal quality and offering promising benefits for large-scale semiconductor manufacturing compared to conventional methods like cooling tubes or thermal gradient control methods. [ABSTRACT FROM AUTHOR]

Copyright of GeSec: Revista de Gestao e Secretariado is the property of Sindicato das Secretarias e Secretarios do Estado de Sao Paulo (SINSESP) and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Small and medium enterprises (SMEs), Then struggle with implementing effective quality management practices, especially in traditional industries like batik production. These challenges include ensuring consistent product quality to differentiate from competitors and attract customers. This study focuses on addressing quality control issues in small-scale Batik Tanah Liek production, where significant defects persist. The research aims to assess existing practices, identify defect causes, and propose solutions to enhance product quality and reduce rejection rates. These efforts contribute to improving production efficiency and supporting the sustainability of this traditional craTh. The study employs a systematic approach combining quality management methodologies, including data collection, problem identification, brainstorming, the Failure Mode and Effects Analysis (FMEA) approach, and actionable recommendations. Data was gathered through a questionnaire to capture perspectives on defects and quality control issues in batik production. Key quality challenges identified include faded batik, torn fabric, and incorrect motifs. Analysis revealed that the primary cause of incorrect motifs is the malfunctioning canting tool, which hinders proper wax application. Additionally, defects in dyeing and boiling processes contribute to fabric fading and tearing, exacerbating quality issues. The findings underscore the need for systematic solutions, such as creating clear work instructions, designing Standard Operating Procedures (SOPs) for process consistency, and implementing preventive maintenance schedules for equipment. By addressing these issues, the study provides practical interventions to improve production quality. These measures not only enhance the economic viability of SMEs but also play a crucial role in preserving the cultural heritage of Batik Tanah Liek. The implications of this research highlight the potential for broader adoption of quality management practices in traditional industries to ensure their sustainability in competitive markets. [ABSTRACT FROM AUTHOR]

Copyright of Metal Working (1674-165X) is the property of Metal Working Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Small and medium enterprises (SMEs) often struggle with implementing effective quality management practices, especially in traditional industries like batik production. These challenges include ensuring consistent product quality to differentiate from competitors and attract customers. This study focuses on addressing quality control issues in small-scale Batik Tanah Liek production, where significant defects persist. The research aims to assess existing practices, identify defect causes, and propose solutions to enhance product quality and reduce rejection rates. These efforts contribute to improving production efficiency and supporting the sustainability of this traditional craft. The study employs a systematic approach combining quality management methodologies, including data collection, problem identification, brainstorming, the Failure Mode and Effects Analysis (FMEA) approach, and actionable recommendations. Data was gathered through a questionnaire to capture perspectives on defects and quality control issues in batik production. Key quality challenges identified include faded batik, torn fabric, and incorrect motifs. Analysis revealed that the primary cause of incorrect motifs is the malfunctioning canting tool, which hinders proper wax application. Additionally, defects in dyeing and boiling processes contribute to fabric fading and tearing, exacerbating quality issues. The findings underscore the need for systematic solutions, such as creating clear work instructions, designing Standard Operating Procedures (SOPs) for process consistency, and implementing preventive maintenance schedules for equipment. By addressing these issues, the study provides practical interventions to improve production quality. These measures not only enhance the economic viability of SMEs but also play a crucial role in preserving the cultural heritage of Batik Tanah Liek. The implications of this research highlight the potential for broader adoption of quality management practices in traditional industries to ensure their sustainability in competitive markets.

UNS N08120, a member of Fe-Ni-Cr alloy family, is capable to withstand severe high temperature and corrosive environments for applications in chemical, power, waste processing etc. Precautionary measures during the casting process can result in sound casting. For the production of UNS N08120 via casting route, the most common method is the vacuum induction melting process, which is less affordable option for small-scale production. Gaseous elements and impurities may get entrapped during casting. The aim of current research is to produce UNS N08120 alloy sound castings using non-vacuum-based induction melting by adding calcium-based reagents and perform a comparative study. This research uses a novel method to reduce the chances of generation of defects that are caused due to the presence of impurities. Two combinations of chemical-based reagents like CaC2, CaO and CaF2 have been selected and used during the sand-casting process. These identified reagents react with the gases and impurities that exist in the molten alloy, and deplete them. The resulting castings yielded alloy free from microstructural defects. This method has been found effective for removal of unwanted gases and impurities in an easy manner. CaF2 addition also plays vital role in degassing phenomenon of UNS N08120. [ABSTRACT FROM AUTHOR]

The overarching aim was to reduce the frequency of connection failures that occur due to the connection speed and reliability, and identify, characterise and optimise the key process input variables (KPIVs). An experimental research approach with an inbuilt planned manipulation to one or more variables in the experimental data set was adopted. Key elements of the Six-Sigma methodology were applied to resolve the issue of high failures due to connection speed and reliability between two Li-Fi transceivers. KPIVs were successfully identified, characterised and optimised to implement a permanent corrective action to ensure a reduction in connection failures from 17% to 0%. The alignment between two Li-Fi transceivers along with Li-Fi cut-out was found to be critical in achieving good connection speed and reliability. The interference due to ambient visible spectrum lighting found to be statistically insignificant. This study explored the application and benefits of accessible wireless data communication technologies. Moreover, it sheds light on the probable factors that may influence Li-Fi connection speed and areas for future research. The current research provides a Six-Sigma based solution to high connection failure rates while using an infrared-based Li-Fi transceiver. Results also offer insights into the analytical tools that were found to be effective during the problem-solving process.

The current research study aimed to explore the utility of selected problem-solving tools and techniques in root-cause analysis to demonstrate their practical application. An experimental research design adopting a positivist empirical approach with a deductive strategy was followed to assess the effectiveness of a combined (8D & Six Sigma) problem-solving approach in reducing a high defects rate of a mixer shower assembly line. A novel application of the 8D framework in combination with Six Sigma and other analytical tools was found highly effective in reducing the reject rate from 11.84% to 0.11%. Successful identification of the root cause led to the implementation of permanent corrective action ensuring a long-term stable assembly process. The research study provided a problem-solving framework that was found effective in resolving a complex problem and implementing long-term corrective action in an assembly production line. However, this framework can be used in other industries. The research study provides a solution to a high number of leak rejects in a sub-assembly where "O-seals" are used between mating parts. It also provides analytical tools that were found highly effective during the problem-solving process.

Purpose: This paper aims to develop the system dynamics model of managing quality costs using the perception maps prepared on the basis of the actual data of the organization. The model depicts the cost of quality and the associated defect percentage to represent the real-world data of the company under study. Model is validated using the different tests to build the confidence on the model. Underlying feedback structures and interactions among various variables make the model more robust and realistic. Design/Methodology/Approach: The simulation software STELLA is used for programming the model. Using the generic structures of the cost of quality, stock and flow diagram is developed to map the real-life business scenario. Findings: Cost of Quality is a forgotten dimension in many companies. Most of the companies are not measuring the cost of quality as a powerful indicator for quality measurement and for process improvement. Defect level is the function of prevention, appraisal and failures (PAF) costs associated with the PAF model. System Dynamics is computer-based simulation methodology that gains the insight of the social, economic, and business problems and acts as a powerful tool for policy design for better decision making. Implications/Originality/Value: Policy analysis clearly indicate that dynamics of cost of quality is quite complex and to identify the prioritized parameter for investment cannot be intuitively appreciated. System dynamics is a simulation-based methodology which can solve the complex interactions and different policy runs lead to the best appropriate mix of cost elements in order to reduce the failure costs (internal and external).

Steel 1.4512 is commonly used in the form of hot rolled bars. The manufacturing of such bars sometimes leads to the formation of edge defects. In this paper, the origin of some edge defects occurring during hot rolling of flat bars is analyzed. Thermomechanical and microstructural evolution calculations have been performed aimed to put in evidence its effect on the product quality and reducing the jagged borders defect on hot rolled bars. A deep investigation has been carried out by analyzing the defects on the final product from both the macroscopic and microstructural point of view through the implementation of thermomechanical and metallurgical models in a Finite Element (FE) MSC, Marc commercial code. Coupled metallurgical and damage models have been implemented to investigate the microstructural evolution of ferritic grain size and material damaging. Three levels of Prior Ferritic Grain Size (PFGS) and three furnace discharge temperatures have been considered in the thermo-mechanical simulations of the roughing passes. Rheological laws for modelling the evolution of ferritic grain have been modified to describe the specific cases simulated. Results have shown that the defect is caused by processing conditions that trigger an anomalous heating which, in turn, induces an uncontrolled grain growth on the edges. The work-hardened and elongated grains do not recrystallize during hot deformation. Consequently, they tend to squeeze out the surrounding softer and recrystallized matrix towards the edges of the bar where the fractures that characterizes the surface defect occur. [ABSTRACT FROM AUTHOR]

A major obstacle to realizing diamond electronics is the presence of device-killing defects. Characteristics of diamond-based diodes are degraded with increasing contact size, and a large Ohmic-like leakage current can be generated. Here, we introduced a buffer layer to suppress the killer defects, which extended from the substrate to the epitaxial layer. With the utilization of the buffer layer created using the metal-assisted termination (MAT) technique, Schottky barrier diodes (SBDs) with diametric sizes of Schottky contact ranging from 65 to 1000 μm were fabricated on heteroepitaxial-grown diamond (001) substrates. The SBDs exhibited an explicit rectifying behavior with a rectification ratio of >1010 even with 1000 μm circular contact (7.85 × 10−3 cm2). Satisfying diode parameters were obtained with an ideality factor of 1.52, a Schottky barrier height of 1.66 eV, and a picoampere of leakage current at a reverse bias of 10 V. Interestingly, the diode parameters of the diamond-based SBDs such as ideality factor, Schottky barrier height and rectifying ratio were likely not changed or degraded even after absorption to 1 MGy in the dose of white X-ray. Overall, this demonstration indicates a promising way to realize a large active area of diamond electronics that is applicable to high-output power transmission devices and detector applications. [Display omitted] • A large area of Schottky contact with a diameter of 1 mm is fabricated on a heteroepitaxial-grown diamond (001) substrate. • 1 mm Schottky barrier diode exhibits a rectifying ratio > 1010 with picoampere-scale leakage current. • The metal-assisted termination (MAT) technique effectively suppresses dislocation propagation from the substrate to the drift layer. • Diamond-based Schottky barrier diodes tolerate against absorption doses of highly energetic X-rays of at least 1 MGy. [ABSTRACT FROM AUTHOR]

Different treatment modalities have been applied for nonmelanoma skin cancers (NMSCs) of the head and neck area. One of the most important points after surgical treatment is the selection of appropriate reconstruction methods. The aim of this study is to investigate the efficacy and feasibility of the use of both defect size reduction with sutures and secondary healing with delayed reconstruction with full-thickness skin grafts in NMSC patients. In total, 18 (42.8%) male and 24 (57.2%) female patients with NMSC were operated. Defect size was measured both after excision and just before repair, and the approximate defect area was calculated with ImageJ software. Reconstruction was performed after 14 days in all patients in the second session, using free skin grafts. There were 18 (42.8%) male and 24 (57.2%) female patients. The mean age was 70.5 (45–82) years. The mean follow-up period was 40.3 (16–68) months. The mean defect area measured after excision was 8.44 ± 1.91 cm 2 . After 14 days of delay, the mean defect area was 5.51 ± 1.28 cm 2 (34.8% reduction) ( p  < 0.05). Defect-reduction methods applied during the first session, together with proper interval prior to placement of graft, have been shown to be beneficial and acceptable methods, providing an advantage in reconstruction with free skin graft. [ABSTRACT FROM AUTHOR]

Objectives: To investigate whether xenograft EB (EndoBon) is non‐inferior to xenograft BO (Bio‐Oss) when used in reconstructive surgery of peri‐implant osseous defects. Materials and methods: Dental patients with one implant each demonstrating peri‐implantitis were randomized to receive surgical debridement and defect fill with either BO or EB. Changes in bone level (BL) and intrabony defect depth (IDD) evaluated radiographically were the primary outcomes. The secondary outcomes included changes in probing pocket depth (PPD), bleeding on probing (BoP), and suppuration on probing (SoP). All outcomes were recorded before treatment and at 6 and 12 months post‐treatment. Results: Twenty‐four patients (n = 11 BO, n = 13 EB) completed the study. Both groups demonstrated significant within‐group improvements in all clinical and radiographic parameters at 6 and 12 months (p ≤.001). At 12 months, both groups presented with IDD reductions of 2.5–3.0 mm on average. The inter‐group differences were not statistically significant at all time points and for all the examined parameters (p >.05). While the radiographic defect fill in both groups exceeded > 1 mm and can be considered treatment success, successful treatment outcomes as defined by Consensus Reporting (no further bone loss, PPD ≤ 5 mm, no BOP, and no SoP) were identified in 2/11 (18%) BO and 0/13 (0%) EB individuals (Fisher's exact test, p =.199). Conclusions: Within the limitations of this pilot study, the application of xenograft EB showed to be non‐inferior to xenograft BO when used in reconstructive surgery of peri‐implant osseous defects. [ABSTRACT FROM AUTHOR]

Data preprocessing remains an important step in machine learning studies. This is because proper preprocessing of imbalanced data can enable researchers to reduce defects as much as possible, which, in turn, may lead to the elimination of defects in existing data sets. Despite the remarkable achievements that have been accomplished in machine learning studies, systematic literature reviews of imbalanced data preprocessing techniques are lacking. Consequently, there are a limited number of systematic literature review studies on imbalanced data preprocessing. In this study, the authors assess the existing literature to identify the key issues related to data quality and handling and to provide a convenient collection of the techniques used to address these issues when performing data preprocessing. They applied a systematic literature review method involving a manual search to select articles published from January 2010 to September 2018 for review. The qualities of the existing studies were assessed using certain quality assessment criteria. Of the 118 relevant studies found, only 2% were identified as having been conducted following systematic literature review guidelines. This study, therefore, calls for more systematic literature review studies on data preprocessing to improve the quality of the data applied in machine learning studies. [ABSTRACT FROM AUTHOR]

With the continuous shrinking of critical dimension, it may require more time and effort to reduce or remove the lithography defects in the development process. Therefore, defect reduction has become one of the most important technical challenges in device mass production. With the purpose of finding an optimizing recipe, we can simulate group parameters, including nitrogen gas dispensation and wafer-rotation speed. From previous studies, we have established a model based on viscous fluid dynamics and have calculated the removing force distribution across the 300-mm-diameter wafer for the defect residual. In this model, we assumed that the defects mostly are polymer residual; once the removing force reached a certain threshold level (1 × 10-14 N), the defect with a "centered-ring-like" signature could be removed. For illustration, several groups of optimal parameter under postdeveloping rinse process conditions are given. The numerical simulations represent several recipes in the development process. We find that we can reproduce a group of the total force curves. From the simulation, we could find that we can get the minimally required strength from the three parameters for defect removal. We have done some experiments to validate the simulation results. The experimental data are almost in agreement with the simulation data. Therefore, the above simulation results have verified the effectiveness and validity of the proposed optimization methodology, and it also has shown that the trend of parameters provided by the optimized method has the potential to be an efficient candidate for reducing or removing lithography defects in the development process. [ABSTRACT FROM AUTHOR]

Manufacturing of ferritic stainless steels flat bars is an important industrial topic and the steel 1.4512 is one of the most commonly used grades for producing this component. In this paper, the origin of some edge defects occurring during hot rolling of flat bars of this grade is analyzed and thermomechanical and microstructural calculations have been carried out to enhance the quality of the finished products by reducing the jagged borders defect on hot rolled bars. An accurate investigation has been carried out by analyzing the defects on the final product from both the macroscopic and microstructural point of view through the implementation of thermomechanical and metallurgical models in a finite element (FE) MSC Marc commercial code. Coupled metallurgical and damage models have been implemented to investigate the microstructural evolution of ferritic grain size and material damaging. Three levels of prior ferritic grain size (PFGS) and three furnace discharge temperatures have been considered in the thermo-mechanical simulations of the roughing passes. Rheological laws for modeling the evolution of ferritic grain have been modified to describe the specific cases simulated. Results have shown that the defect is caused by processing conditions that trigger an anomalous heating which, in turn, induces an uncontrolled grain growth on the edges. The work-hardened and elongated grains do not recrystallize during hot deformation. Consequently, they tend to squeeze out the surrounding softer and recrystallized matrix towards the edges of the bar where the fractures that characterizes the surface defect occur.

Convective self-assembly has been demonstrated to be useful as a technique to generate self-assembled monolayers of nanoparticles over a given area. These films, however, suffer from defects that occur with misaligned grain boundaries and point defects from missing particles. We demonstrate the effect of surfactant modified substrate and external mechanical vibration on reducing the inherent defects in colloidal monolayers obtained using an industrially scalable process: convective assembly. Surface modified substrates coupled with vibration during the deposition resulted in a higher degree of ordering over a large deposition area. Numerical investigation further shows the increased capability of these external modifiers helps in producing better quality films. A significant 86% reduction in the defects, with larger crystal domains are realized in comparison to control, enabling this technique to easily be scaled up for various industrial applications. [ABSTRACT FROM AUTHOR]

The generated resist based defects on the template in addition to the presence of particles and contaminants is critical for ultraviolet curing of nanoimprint lithographic fabrication. This procedure is proven to be suitable for advanced resist material design under the process conditions. Nanoimprint resist material containing an ultraviolet reactive fluorine surfactant was developed to modify the fundamental surface interactions between resists and the template for defect reduction in nanoimprint patterning replication. The developed acrylate type nanoimprint resist material containing 4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,11-heptadecafluoro-2-hydroxyundecyl acrylate as an ultraviolet reactive fluorine surfactant, indicated excellent patterning dimensional accuracy by minimizing surface free energy, and having the effect of improving the generated resist based defect numbers on the template, with a 500 nm contact hole and 2 μm line patterns, in the replication of 20 nanoimprint process cycles. This desirable concept using an ultraviolet reactive fluorine surfactant with an acrylate group in the acrylate type nanoimprint resist material is one of the most promising processes ready to be incorporated into mass fabrication in the next generation of electronic devices.

The FDM numerical simulation software, ViewCast system, was employed to simulate the low pressure die casting (LPDC) of an aluminum wheel. By analyzing the mold-fi lling and solidifi cation stage of the LPDC process, the distribution of liquid fraction, temperature field and solidification pattern of castings were studied. The potential shrinkage defects were predicted to be formed at the rim/spoke junctions, which is in consistence with the X-ray detection result. The distribution pattern of the defects has also been studied. A solution towards reducing such defects has been presented. The cooling capacity of the mold was improved by installing water pipes both in the side mold and the top mold. Analysis on the shrinkage defects under forced cooling mode proved that adding the cooling system in the mold is an effective method for reduction of shrinkage defects.

The development of tin-based perovskite solar cells (Sn–PSCs) is hindered by the issue of high defect density in Sn-perovskite film, which seriously deteriorates the power conversion efficiency (PCE) and stability. Herein, an ionic compensation strategy is proposed by adding guanidine iodide (GAI) into the FA 0.75 MA 0.25 SnI 3 precursor solution to fabricate high-quality Sn-perovskite films by healing multi-vacancy defects. GA+ cations are rationally incorporated into perovskite crystal to compensate for the organic cation vacancies during thermal annealing, while the I-rich condition can simultaneously heal the iodine vacancies. This method significantly improves the crystalline quality and surface morphology of Sn-perovskite films during annealing. At the same time, the optimized film obtains a reduction in the density of defect states and an extension of the carrier lifetime. Consequently, the best performing Sn-PSC modified by ionic compensation with GAI achieves an increase in PCE from 7.56% (control device) to 10.41%, while also improving stability, retaining ∼83% of the initial PCE after aging for 30 days in an N 2 environment without encapsulation. This work represents that the ionic compensation strategy is an effective and practical approach toward reducing defects and realizing enhanced performance of Sn–PSCs. [Display omitted] •Ionic compensation stabilizes perovskite crystals during thermal annealing. • GAI additive reduces defect formation in tin-based perovskite films. • An extension of the carrier lifetime has been achieved. • The PSC modified with GAI additive shows an increase in efficiency to 10.41%. [ABSTRACT FROM AUTHOR]

High-defect density in thermodynamics driven directed self-assembly (DSA) flows has been a major cause of concern for a while and several questions have been raised about the relevance of DSA in high-volume manufacturing. The major questions raised in this regard are: (1) What is the intrinsic level of DSA-induced defects? (2) Can we isolate the DSA-induced defects from the other processes-induced defects? (3) How much do the DSA materials contribute to the final defectivity and can this be controlled? (4) How can we understand the root causes of the DSA-induced defects and their kinetics of annihilation? (5) Can we have block copolymer anneal durations that are compatible with standard CMOS fabrication techniques (in the range of minutes) with low-defect levels? We address these important questions and identify the issues and the level of control needed to achieve a stable DSA defect performance. [ABSTRACT FROM AUTHOR]

The ceramic industry has witnessed fast growth in emerging and developing countries primarily due to growth in power, construction and housing sectors. The production of ceramic products can be divided in to two distinct phases: pre-kiln operations and post-kiln operations. The rejections in pre-kiln operations can be pushed back into the process without much loss to the environment. However, the post-kiln rejections cannot be recycled. Also, most of the energy is spent in the kiln process leading to high damage to environment. This paper presents a case study of ceramic industry to reduce the post-kiln rejections in the manufacturing of insulators for power sector. Ishikawa diagrams have been used to find the root causes of various rejections in post-kiln operations. The implementation of simple kaizens has led to more than 40% reduction in post-kiln rejections thus saving energy and loss to environment. [ABSTRACT FROM AUTHOR]

Nonpolar (1 0 −1 0) m -plane GaN has been grown on m -plane sapphire substrates by hydride vapor phase epitaxy (HVPE). We studied the defect reduction of m -GaN with embedded SiN x interlayers deposited by ex-situ metal organic chemical vapor deposition (MOCVD). The full-width at half-maximum values of the X-ray rocking curves for m -GaN with embedded SiN x along [1 1 −2 0] GaN and [0 0 0 1] GaN were reduced to 528 and 1427 arcs, respectively, as compared with the respective values of 947 and 3170 arcs, of m -GaN without SiN x . Cross-section transmission electron microscopy revealed that the basal stacking fault density was decreased by approximately one order to 5×10 4 cm −1 due to the defect blocking of the embedded SiN x . As a result, the near band edge emission intensities of the room-temperature and low-temperature photoluminescence showed approximately two-fold and four-fold improvement, respectively. [ABSTRACT FROM AUTHOR]

In this paper we describe the implementation and the characterisation of five different in-situ defect reduction techniques for non-polar ( a -plane) GaN growth on r -plane sapphire. Sample 1 (3D/2D) employs a methodology frequently applied on the c -plane, involving a low temperature nucleation layer (LTNL) followed by 3D GaN island formation and lateral coalescence. For Sample 2 (d3D) GaN islands are grown directly onto the sapphire with no LTNL, followed by lateral growth. Sample 3 (d3D Si) follows a similar procedure, but with high silicon doping in order to adjust the 3D GaN island shape. Sample 4 (SiNx) utilises a silicon nitride interlayer between a LTNL and subsequent growth of a GaN layer. Sample 5 is grown by epitaxial lateral overgrowth (ELOG) coupled with a SiNx interlayer. X-ray diffraction, scanning electron microscopy and cathodoluminescence are used to identify defects, and determined the threading defect density to vary from 1 x 1010-1 x 109 cm-2 and basal-plane stacking fault (BSF) density to vary from 5 x 105 - 5 x 103 cm-1. The improvement in crystal quality is reflected in the photoluminescence spectra by a comparison of the ratio of the GaN near band edge (NBE) emission to the BSF associated emission. It was determined that the ELOG method was most successful in blocking BSFs, with a density reduction of 2 orders of magnitude resulting in a fifteen-fold increase in the NBE:BSF emission ratio increase. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

A “hybrid” post Cu CMP cleaning process that combines acidic and basic clean in sequence is developed and implemented. The new process demonstrates the strengths of both acidic and basic cleans and achieves a more than 60% reduction in CMP defects, such as polish residues, foreign materials, slurry abrasives, scratches, and hollow metal, relative to an all-basic clean process. It also eliminates the circular ring defects that occur intermittently during roller brush cleans. TXRF scans confirm the reduction of AlOx defects when using the hybrid clean process. XPS spectra show similar Cu surface oxidation states between the basic and hybrid clean processes. As revealed by XRD analysis, surface Cu oxide is dissolved into aqueous solution by the acidic clean chemical. The formation mechanism of circular ring defects and the key to their elimination is discussed. [ABSTRACT FROM AUTHOR]

A test structure specifically designed to allow inline detection of missing spacer is introduced. Missing spacer is too small to be physically detected with any current inspection tool and therefore its existence must be flagged using voltage contrast for detection with an e-beam inspection system. The structure and methodology used to address this defect during the ramp of a recent technology is described. Key benefits include a dramatically faster learning cycle and much better signal-to-noise ratio for split experiment evaluation. Missing spacer is one example of a growing class of nonvisual defects which will greatly impact future semi-conductor technologies. General principles for designing test structures to detect these defect types are discussed. [ABSTRACT FROM AUTHOR]

Abstract: This paper first discusses laser crystallization of silicon (Si) films with a carbon optical absorption layer, which makes it possible to use an infrared laser light. Then we discuss heat treatment with high-pressure H2O vapor for defect reduction of laser crystallized Si films and their interface for fabrication of high performance Si thin film transistors (TFTs). Finally, we present a method of transfer process of electrical circuits from original glass substrates to foreign plastic films, developed with GeO2 removing layer. [Copyright &y& Elsevier]