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12. High performance strained Germanium Gate All Around p-channel devices with excellent electrostatic control for sub-Jtlnm LG

14. First Demonstration of Vertically Stacked Gate-All-Around Highly Strained Germanium Nanowire pFETs

15. First demonstration of vertically-stacked Gate-All-Around highly-strained Germanium nanowire p-FETs

17. The relation between phase transformation and onset of thermal degradation in nanoscale CoSi2-polycrystalline silicon structures.

18. Strained Germanium Gate-All-Around pMOS Device Demonstration Using Selective Wire Release Etch Prior to Replacement Metal Gate Deposition

20. The relation between phase transformation and onset of thermal degradation in nanoscale CoSi2-polycrystalline silicone structures

21. Strained germanium quantum well p-FinFETs fabricated on 45nm Fin pitch using replacement channel, replacement metal gate and germanide-free local interconnect

22. First demonstration of 15nm-WFIN inversion-mode relaxed-Germanium n-FinFETs with Si-cap free RMG and NiSiGe Source/Drain

23. Strain enhanced low-VT CMOS featuring La/Al-doped HfSiO/TaC and 10ps invertor delay

24. Performance and reliability of high-mobility Si0.55Ge0.45 p-channel FinFETs based on epitaxial cladding of Si Fins

25. 15nm-WFIN high-performance low-defectivity strained-germanium pFinFETs with low temperature STI-last process

27. Strained Germanium quantum well pMOS FinFETs fabricated on in situ phosphorus-doped SiGe strain relaxed buffer layers using a replacement Fin process

28. Occurrence and distribution of the mycotoxin-producing Fusarium species isolated from winter wheat in Luxemburg in 2007 and 2008

29. Fusarioses sur blé d’hiver au Grand-Duché de Luxembourg. Premiers résultats d’une enquête commencée en 2007 sur l’identification des agents de la fusariose.

30. [Physiopathological significance of the overexpression of ApN muscle in the event of stress]

31. First Report of Fusarium Head Blight on Winter Wheat in the Grand Duchy of Luxembourg

34. Understanding of Trap-Assisted Tunneling Current - Assisted by Oxygen Vacancies in RuOx/SrTiO3/TiN MIM Capacitor for the DRAM Application

37. Highly Scaled Vertical Cylindrical SONOS Cell With Bilayer Polysilicon Channel for 3-D nand Flash Memory

38. (Invited) Plasma Enhanced Atomic Layer Deposited Ruthenium for MIMCAP Applications

39. Impact of bottom electrode and SrxTiyOz film formation on physical and electrical properties of metal-insulator-metal capacitors

40. Advanced Capacitor Dielectrics: Towards 2x nm DRAM

41. Novel Bi-Layer Poly-Silicon Channel Vertical Flash Cell for Ultrahigh Density 3D SONOS NAND Technology

44. Impact of crystallization behavior of SrxTiyOz films on electrical properties of metal-insulator-metal capacitors with TiN electrodes

46. High yield sub-0.1µm2 6T-SRAM cells, featuring high-k/metal-gate finfet devices, double gate patterning, a novel fin etch strategy, full-field EUV lithography and optimized junction design & layout

48. Migrating from planar to FinFET for further CMOS scaling: SOI or bulk?

50. Carbon-based thermal stabilization techniques for junction and silicide engineering for high performance CMOS periphery in memory applications

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