13 results on '"Verheijden, G.J.A.M."'
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2. Challenges in the implementation of low-k dielectrics in the back-end of line
3. Advanced Cu interconnects using air gaps
4. A piezo-resistive resonant MEMS amplifier
5. Wafer level encapsulation technology for MEMS devices using an HF-permeable PECVD SIOC capping layer
6. Scalable 1.1 GHz fundamental mode piezo-resistive silicon MEMS resonator
7. Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask
8. Reliability of wafer level thin film MEMS packages during wafer backgrinding.
9. 56 MHZ piezoresistive micromechanical oscillator.
10. Air gap integration for the 45nm node and beyond.
11. Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics.
12. Air gap integration for the 45nm node and beyond
13. Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics
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