1,099 results on '"Tu, K. N."'
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2. The design of quaternary eutectic solder by machine learning
3. A high entropy alloy as very low melting point solder for advanced electronic packaging
4. Interconnect Quality and Reliability of 3D Packaging
5. Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films
6. Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
7. Modeling of abnormal grain growth in (111) oriented and nanotwinned copper
8. Interconnect Quality and Reliability of 3D Packaging
9. Interconnect Quality and Reliability of 3D Packaging
10. Fabrication and characteristics of highly ⟨110⟩-oriented nanotwinned Au films
11. Microstructure evolution of tin under electromigration studied by synchrotron X-Ray micro-diffraction
12. Electromigration in three-dimensional integrated circuits
13. Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
14. Coupled nucleation of dual-phase lamellar structure
15. Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
16. Interconnect Quality and Reliability of 3D Packaging
17. Stress analysis of spontaneous Sn whisker growth
18. Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
19. Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
20. Metallurgical Factors
21. Unidirectional Growth of Microbumps on (111)-0riented and Nanotwinned Copper
22. Modeling of Cu-Cu Thermal Compression Bonding
23. A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production.
24. Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper
25. Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain
26. Analysis of Oxygen Diffusion in Superconducting YBa2Cu3O7−δ Ceramic Oxides
27. Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps
28. Void ripening in Cu-Cu bonds
29. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products
30. Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
31. Undercooling and microstructure analysis for the design of low melting point solder
32. Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging
33. Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
34. Analytical modeling of reservoir effect on electromigration in Cu interconnects
35. Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint
36. Ni implantation-induced enhancement of the crystallisation of amorphous Si
37. Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects
38. A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints
39. Effect of electromigration on mechanical shear behavior of flip chip solder joints
40. Relieving the current crowding effect in flip-chip solder joints during current stressing
41. The application of lead-free solder to optical fiber packaging
42. Interfacialreactions and impactreliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads
43. Elimination of Au-embrittlement in solder joints on Au/Ni metallization
44. Electromigration failure in flip chip solder joints due to rapid dissolution of copper
45. Growth and Ripening of (Au,Ni)Sn4 Phase in Pb-Free and Pb-Containing Solders on Ni/Au Metallization
46. Formation of nickel disilicide using nickel implantation and rapid thermal annealing
47. Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–Cu solder and thin film metallization
48. Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints
49. Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages
50. Electromigration in solder joints and solder lines
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