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A novel micromachined X-ray collector using anisotropically etched Si(1 1 1) side walls as X-ray mirrors for future astronomical missions is reported. The collector was designed to converge a ϕ 100 mm parallel X-ray beam into a ϕ 4 mm focus. In order to obtain smooth Si(1 1 1) side walls, dynashock-type ultrasonic waves were added during the anisotropic KOH etching. The surface roughness on the order of nm or less was achieved. The sidewalls or the X-ray mirrors were diced from the wafer as mirror chips and then adhered to a mount formed by deep reactive ion etching. The first light image was successfully obtained at Al K α 1.49 keV in a ISAS 30 m-long X-ray beam line.

著者人数: 34名, Accepted: 2006-09-26, 資料番号: SA1000369000

We present a plan on soft X-ray calibration for the New Exploration X-ray Telescope (NeXT). Two hard and two soft X-ray telescopes (HXTs/SXTs: see Ogasaka et al. 2008 in this volume) provide images up to 80 keV with a large effective area. Following to the Suzaku X-ray telescope, the mirrors on SXTs are tightly nested to maximize the aperture efficiency. To illuminate the mirrors at all, we plan to adopt a raster scan system using a pencil beam collimated from an X-ray generator. We summarize a current status of the soft X-ray ground calibration system at ISAS/JAXA. We also review the calibration of the Suzaku XRTs since the optics are very similar to the NeXT SXTs.

The “rst light of a ultra-lig htweight and low-cost micro-pore X-ray optic utilizing MEMS (Micro Electro Me-chanical Systems) technologies is reported. Our idea is to use silicon (111) planes appeared after anisotropic wetetching of silicon wafers. As a “rst step to Wolter type-1 optics, a single-stage optic with a focal length of 750mm and a diameter of 100 mm was designed for energies below 2 keV. The optic consists of 218 mirror chipsfor X-ray re”ection and an optic mount for packing these chips. Design parameters and required fabricationaccuracies were determined with numerical simulations. The fabricated optic satis“ed these accuracies and itsimaging quality was measured at the ISAS X-ray beam line at Al K 1.49 keV. A focused image was successfullyobtained. The measured image size of 4 mm was consistent with the chip sizes. The estimated X-ray re”ectiv-ity also could be explained by micro-roughness of less than 3 nm and geometrical occulting eect due to largeobstacle structures on the re”ection surface.Keywords: X-ray astronomy, X-ray optics, Light weight, MEMS

A novel micromachined X-ray collector using anisotropically etched Si (111) planes as X-ray mirrors for future astronomical missions is reported. Mirrors, fabricated using dynashock-type ultrasonic waves, have very smooth surfaces with an rms roughness of nm or less. After the etching, mirror chips were cut from the wafer with a dicing machine and adhered to a mount formed by deep reactive ion etching, in order to collect parallel X-ray beam (0100 mm) on a tiny focus (phi 4 mm). The first light image was successfully obtained at Al Kalpha 1.49 keV in a ISAS 30 m-long beam line.