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14 results on '"Stepniak, Frank"'

2. The electronic nature of the metal-metal quadruple bond: variable photon energy photoelectron spectroscopy of Mo2(O2CCH3)4

Author

Lichtenberger, Dennis L., Ray, Charles D., Stepniak, Frank, Yu Chen, and Weaver, J.H.

Subjects
Chemical bonds -- Analysis, Photoelectron spectroscopy -- Usage, Chemistry
Abstract

The valence ionizations of the metal-metal quadruple bond was examined by variable photon energy photoelectron spectroscopy of Mo2(O2CCH3)4. The metal-based delta, pi and sigma ionizations of the quadruple bond are strongly enhanced relative to the acetate-based ionizations in the region of photon energies from 40 to 50 eV. The pi ionization has the largest contribution to the metal-metal bond strength. The delta and sigma ionizations, partly because of their overlap with ligand orbitals, have less of a contribution to the metal-metal bond strength.

Published
1992

6. Silver Metallization for Advanced Interconnects.

Author

Manepalli, Rahul and Stepniak, Frank

Subjects
*SILVER, *MICROELECTRONICS
Abstract

Presents information on a study which examined the reliability of silver and the potential benefits of silver metallization in terms of future trends in microelectronic interconnections. Mechanical and electrical benefits of silver; Reliability test of the corrosion threshold voltage of silver; Experimental details; Results and discussion; Conclusions.

Published
1999
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7. Copper Stud Bumping for Flip-Chip Applications.

Author

Levine, Lee, Chaudhuri, Arun, and Stepniak, Frank

Subjects
INTEGRATED circuits, MANUFACTURING processes, INDUSTRIAL engineering, COPPER, SOLDER pastes
Abstract

Highlights the cost effectiveness of using copper stud bumping in flip-chip process for devices with low to medium input/output density, initiated by Delphi Electronics & Safety and Kulicke & Soffa. Cross-section of a low-cost copper stud bumping combined with stencil-printed solder paste; Forms of solder application in flip-chip; Materials used in forming copper stud bumps;

Published
2006

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