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Wheat-based foods has emerged as another potential vehicle for foodborne illness in humans. The recent occurrence of recalls involving wheat-based foods requires a full understanding of how these pathogens thrive in these food products and developing potential intervention strategies to address pathogen contamination. This manuscript is the second of a two-part review covering the status of the food safety of wheat-based products. In this manuscript, available information on the survival of enteric foodborne pathogens, food safety issues, and potential pathogen reduction steps on wheat-based foods were reviewed. Shiga toxin-producing E. coli and Salmonella are capable of surviving in wheat flours and grains for extended periods (≤ 2 years). Based on the food safety issues linked to wheat flour, the main enteric pathogens of concern are STEC (O157, O121, O26, and O103) and Salmonella . Diverse interventions such as tempering treatments, thermal treatments, and non-thermal technologies all effectively reduced the pathogenic loads of wheat grains and wheat flours (2 to 6 log CFU/g reduction). Addressing pathogen contamination of wheat-based foods is a major concern for the milling industry. Future studies could be focused on improving pathogen reduction performance and validating their effects against diverse product and process conditions.

The cultivation and processing of wheat render it susceptible to microbial contamination from varied sources. Hence, pathogens such as Salmonella can contaminate wheat grains, which poses a food safety risk in wheat-based products. This risk is displayed by the incidence of foodborne illness outbreaks linked to Salmonella-contaminated wheat flour and flour-based products. The purpose of this study was to assess the effectiveness of combining acidic water and heat treatment in reducing the Salmonella load of hard red spring (HRS) wheat grains during tempering. Effective treatments were then evaluated for their effects on wheat flour quality. Tempering with sodium bisulfate (SBS), lactic acid (LA), and citric acid (CA) at 15% w/v alone reduced (p < 0.001) wheat Salmonella load by 3.15, 3.23, and 2.91 log CFU/g, respectively. Heat treatment (55 °C) reduced (p < 0.001) wheat Salmonellaload by 4.1 log CFU/g after 24 h of tempering. Combining both tempering and heat treatments resulted in a greater reduction in Salmonella load as non-detectable levels (<2 log CFU/g) of Salmonella in the wheat grains were obtained after 12 h of tempering with LA (15%) + heat. A similar result were achieved for both SBS (15%) + heat and CA (15%) + heat treatments after 18 h of tempering. Applying the combined treatments in HRS wheat grains resulted in comparable wheat flour baking (volume, texture, and crumb structure) and physicochemical properties (rheology and composition) relative to the control (tempering with water alone). The results from this study has the potential to be utilized for developing more effective methods for improving the food safety of wheat flour against Salmonella contamination., Competing Interests: Declaration of competing interest The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper., (Copyright © 2023 Elsevier Ltd. All rights reserved.)