32 results on '"Shieh, J.H."'
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2. Systematic variation of TN(Pr) for the two-CuO2-layer cuprate m212 (M=1,2,3) systems
3. Magnetic ordering of Pr in Pb2Sr2PrCu3O8
4. THERMODYNAMIC ANALYSIS OF A BIOMASS PYROLYSIS PROCESS**Presented at the Symposium on Feed, Fuels and Chemicals from Wood and Agricultural Residues, 184th ACS National Meeting, Kansas City, MO, Sept. 12-17, 1982.
5. A 32nm CMOS Low Power SoC Platform Technology for Foundry Applications with Functional High Density SRAM
6. Damage-Free Low-k Treatment Verified by a Novel Microwave Measurement
7. Characterization of strip induced damage in ultra low-k dielectric
8. Characterization of the tumor-specific activity of WT1 specific T cells generated in vitro from normal individuals by sensitization with WT1-peptide loaded autologous EBV transformed B cells
9. Ionic-size effect on the structure and Tc of T′-(R1−xR′x)1.85Ce0.15CuO4 (R Pr, Nd, Sm and Eu; R′ Gd and Y)
10. Coexistence of antiferromagnetic order and superconductivity with TN higher than Tc in DyNi2B2C
11. Superconductivity and magnetic ordering in Pb2Sr2PrCu3O8.01
12. Comparative studies of Gd-ordering in various cuprate systems
13. Magnetic behavior in Pr-containing Tl- and Pb-based cuprates
14. Calorimetric study of copper ordering in the T' (214) system
15. Superconductivity and magnetic ordering in the (Nd1−xGdx)1·85Ce0·15CuO4−δ System
16. Supercritical CO2 clean with novel solution for 65 nm and beyond BEOL performance improvement.
17. Effect of ash process on leakage mechanism of Cu/ELK (k=2.5) interconnect for 65/45 nm generation.
18. Reliability and conduction mechanism study on organic ultra low-k (k=2.2) for 65/45 nm hybrid Cu damascene technology.
19. Thermodynamically based analysis and synthesis of chemical process systems
20. Practical application of process systems engineering to energy and resource conservation and management
21. Process study of chemically vapour-deposited SnOx (x≈2) films
22. Magnetic Properties Of Pb/sub 2/Sr/sub 2/PrCu/sub 3/O/sub 8/ studied using AC susceptibility
23. Reliability and conduction mechanism study on organic ultra low-k (k=2.2) for 65/45 nm hybrid Cu damascene technology
24. Supercritical CO/sub 2/ clean with novel solution for 65 nm and beyond BEOL performance improvement
25. Effect of ash process on leakage mechanism of Cu/ELK (k=2.5) interconnect for 65/45 nm generation
26. Direct Non-Contact Electrical Measurement of Low-k Damage in Patterned Low-k Films by a Near-Field Scanned Microwave Probe.
27. Investigation of plasma-induced damage of nickel mono-silicide in semiconductor manufacturing.
28. Low k damage control & its reliability for organic hybrid dual damascene.
29. Integration of Cu and extra low-k dielectric (k=2.5/spl sim/2.2) for 65/45/32nm generations.
30. Magnetic Properties Of Pb/sub 2/Sr/sub 2/PrCu/sub 3/O/sub 8/ studied using AC susceptibility.
31. Ionic-size effect on the structure and Tc of T′-(R 1− xR′ x) 1.85Ce 0.15CuO 4 (R Pr, Nd, Sm and Eu; R′ Gd and Y)
32. Process study of chemically vapour-deposited SnO x (x≈2) films
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