1. Hot Deformation Behavior and Microstructure Evolution of a Graphene/Copper Composite
- Author
-
Tiejun Li, Ruiyu Lu, Yuankui Cao, Bicheng Liu, Ao Fu, and Bin Liu
- Subjects
graphene/copper composite ,hot deformation behavior ,dynamic recrystallization ,microstructure ,Technology ,Electrical engineering. Electronics. Nuclear engineering ,TK1-9971 ,Engineering (General). Civil engineering (General) ,TA1-2040 ,Microscopy ,QH201-278.5 ,Descriptive and experimental mechanics ,QC120-168.85 - Abstract
Graphene/copper composites are promising in electronic and energy fields due to their superior conductivity, but microstructure control during thermal mechanical processing (TMP) remains a crucial issue for the manufacturing of high-performance graphene/copper composites. In this study, the hot deformation behavior of graphene/copper composites was investigated by isothermal compression tests at deformation temperatures of 700~850 °C and strain rates of 0.01~10 s−1, and a constitutive equation based on the Arrhenius model and hot processing map was established. Results demonstrate that the deformation mechanism of the graphene/copper composites mainly involves dynamic recrystallization (DRX), and such DRX-mediated deformation behavior can be accurately described by the established Arrhenius model. In addition, it was found that the strain rate has a stronger impact on the DRX grain size than the deformation temperature. The optimum deformation temperature and strain rate were determined to be 800 °C and 1 s−1, respectively, with which a uniform microstructure with fine grains can be obtained.
- Published
- 2024
- Full Text
- View/download PDF