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Hot Deformation Behavior and Microstructure Evolution of a Graphene/Copper Composite
- Source :
- Materials, Vol 17, Iss 16, p 4010 (2024)
- Publication Year :
- 2024
- Publisher :
- MDPI AG, 2024.
-
Abstract
- Graphene/copper composites are promising in electronic and energy fields due to their superior conductivity, but microstructure control during thermal mechanical processing (TMP) remains a crucial issue for the manufacturing of high-performance graphene/copper composites. In this study, the hot deformation behavior of graphene/copper composites was investigated by isothermal compression tests at deformation temperatures of 700~850 °C and strain rates of 0.01~10 s−1, and a constitutive equation based on the Arrhenius model and hot processing map was established. Results demonstrate that the deformation mechanism of the graphene/copper composites mainly involves dynamic recrystallization (DRX), and such DRX-mediated deformation behavior can be accurately described by the established Arrhenius model. In addition, it was found that the strain rate has a stronger impact on the DRX grain size than the deformation temperature. The optimum deformation temperature and strain rate were determined to be 800 °C and 1 s−1, respectively, with which a uniform microstructure with fine grains can be obtained.
- Subjects :
- graphene/copper composite
hot deformation behavior
dynamic recrystallization
microstructure
Technology
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Engineering (General). Civil engineering (General)
TA1-2040
Microscopy
QH201-278.5
Descriptive and experimental mechanics
QC120-168.85
Subjects
Details
- Language :
- English
- ISSN :
- 19961944
- Volume :
- 17
- Issue :
- 16
- Database :
- Directory of Open Access Journals
- Journal :
- Materials
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.02159ea295994105804387e2f3530c4c
- Document Type :
- article
- Full Text :
- https://doi.org/10.3390/ma17164010