35 results on '"Ristolainen, E.O."'
Search Results
2. An Experimental Study of Scalability in Shield-Based On-Wafer CMOS Test Fixtures
3. The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs
4. A novel test fixture with enhanced signal port isolation capability for on-wafer microwave measurements.
5. 3D integration of electronics and mechanics.
6. Embedded RF Balun for 3D System-in-Package Solutions.
7. A modified shield-based test fixture for silicon-on-insulator (SOI) to mitigate the uncertainties of the parallel parasitics.
8. Reliability evaluation structures for stacked thin dice packaging.
9. Stacked 3-D MCP with plastic ball vertical interconnections.
10. Reliability evaluation of 3D-package with specific test structures.
11. Pull testing of lead-free QFP solder joints.
12. Reliability study of 3-D stacked structures.
13. Corrosion behavior of decorative car parts and outdoor lighting fixtures fabricated from TiN-coated stainless steel
14. Characterisation of interfacial layer between nitrogen alloyed stainless steel and alumina in a metal matrix composite
15. The influence of titanium interlayers on the adhesion of PVD TiN coatings on oxidized stainless steel substrates
16. Comparison of the corrosion resistance of TiN and (Ti,Al)N coatings
17. Characterization of the interface and intermediate layers of TiN/Ti/substrates systems
18. Improved corrosion resistance of hard nitride coatings
19. Auger electron spectroscopy of silicon wafers
20. Investigation of surface coating structure by scanning auger microscopy
21. The effect of the intermetallic layer on the adherence of a hot-dip galvanized coating
22. EELS studies of scanning auger spectroscopy
23. 3D integration of electronics and mechanics
24. Effects of 3D shapes in PWB design
25. A modified shield-based test fixture for silicon-on-insulator (SOI) to mitigate the uncertainties of the parallel parasitics
26. System design issues for 3D system-in-package (SiP)
27. Reliability study of 3-D stacked structures
28. A novel test fixture with enhanced signal port isolation capability for on-wafer microwave measurements
29. Reliability evaluation of 3D-package with specific test structures
30. Pull testing of lead-free QFP solder joints
31. Embedded RF Balun for 3D System-in-Package Solutions
32. Effects of 3D shapes in PWB design.
33. On-wafer inductors for SOS-based RF ICs.
34. System design issues for 3D system-in-package (SiP).
35. Ultra high-frequency characterization of high-density 3D module.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.