Stacked 3-D MCP with plastic ball vertical interconnections.

Authors :: Miettinen, J.
Tanskaneu, J.
Ristolainen, E.O.
Source :: Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p1101-1105, 5p
Publication Year :: 2003

Language :: English
ISBNs :: 9780780377912
Database :: Complementary Index
Journal :: Proceedings of the 53rd Electronic Components & Technology Conference, 2003
Publication Type :: Conference
Accession number :: 81103689
Full Text :: https://doi.org/10.1109/ECTC.2003.1216428