1. The H2020-SPACE-SIPHODIAS project: space-grade opto-electronic interfaces for photonic digital and analogue very-high-throughput satellite payloads
- Author
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Y. Zhou, F. Schaub, M. Irion, Leontios Stampoulidis, Gunter Fischer, Herbert Zirath, L. Cyrille, S. Duffy, Norbert Venet, Ilias Sourikopoulos, Ian Oxtoby, Juan Barbero, Mickael Faugeron, R. G. Walker, G. Bouisset, Stavros Giannakopoulos, Michel Sotom, D. Lopez, Anaelle Maho, and P. Ostrovskyy
- Subjects
Chipset ,business.industry ,Computer science ,Electrical engineering ,Technology readiness level ,BiCMOS ,7. Clean energy ,01 natural sciences ,Vertical-cavity surface-emitting laser ,High-throughput satellite ,0103 physical sciences ,Transceiver ,Photonics ,010306 general physics ,business ,Throughput (business) - Abstract
The EU-SIPhoDiAS project deals with the development of critical photonic building blocks needed for high-performance and low size, weight, and power (SWaP) photonics-enabled Very High Throughput Satellites (VHTS). In this presentation, we report on the design and fabrication activities during the first year of the project concerning the targeted family of digital and microwave photonic components. This effort aims to demonstrate components of enhanced reliability at technology readiness level (TRL) 7. Specifically, with respect to microwave photonic links, we report: (i) the design of Ka and Q-bands analogue photodetectors that will be assembled in compact packages, allowing for very high bandwidth per unit area and (ii) on the design of compact V-band GaAs electro-optic modulator arrays, which use a folded-path optical configuration to manage all fiber interfaces packaged opposite direct in-line RF feeds for ease of board layouts and mass/size benefits. With respect to digital links, we report on the development of 100 Gb/s (4 x 25 Gb/s) digital optical transceiver sub-assemblies developed using flip-chip mounting of electronic and opto-parts on a high-reliability borosilicate substrate. The transceiver chipset developed specifically for this project refers to fully-custom 25 Gb/s radiation hard (RH) VCSEL driver and TIA ICs designed in IHP’s 130 nm SiGe BiCMOS Rad-Hard process.
- Published
- 2021
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