23 results on '"Pellat, M."'
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2. Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications
3. Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology
4. Development and adhesion characterization of a silicon wafer for temporary bonding
5. Delamination Root Cause in Temporary Bonding
6. Traitement et appareillage des mutilés de la face : contribution de la mise en charge immédiate sur implants de prothèse complète amovible mandibulaire chez l’édenté total
7. 3D Integration challenges today from technological toolbox to industrial prototypes
8. WSS and ZoneBOND temporary bonding techniques comparison for 80μm and 55μm functional interposer creation
9. Innovative wafer-level encapsulation & underfill material for silicon interposer application
10. Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process
11. Pixel level packaging for uncooled IRFPA
12. Recent development in pixel level packaging for uncooled IRFPA
13. Hermetic wafer-level packaging development for RF MEMS switch
14. Innovative wafer-level encapsulation & underfill material for silicon interposer application.
15. Low cost Thin Film packaging for MEMS over molded.
16. Hermetic wafer-level packaging development for RF MEMS switch.
17. Sur L' Uropetalum Bourgæi Nym
18. Sur Quelques Variations Que Présentent Les Végétaux Avec L'Altitude
19. Lettre à M. Malinvaud
20. Sur Quelques Variations Que Présentent Les Végétaux Avec L'Altitude
21. Sur L'Uropetalum BourgæiNym.
22. On the Limit between Polarization and Electrolysis
23. [Report of 39 traumatic and iatrogenic lesions of the extra-cranial carotid artery (author's transl)].
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