Low cost Thin Film packaging for MEMS over molded.

Authors :: Pornin, J.-L.
Gillot, C.
Billard, C.
Lagoutte, E.
Pellat, M.
Parat, G.
Sillon, N.
Source :: Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-4, 4p
Publication Year :: 2010

Language :: English
ISBNs :: 9781424485536
Database :: Complementary Index
Journal :: Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Publication Type :: Conference
Accession number :: 81373168
Full Text :: https://doi.org/10.1109/ESTC.2010.5642964