6 results on '"Oshida, D."'
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2. Path-finding for integration of porous SiOCH films (k∼2.5) in system-LSIs
3. Quantitative analysis of correlation between insulator surface copper contamination and TDDB lifetime based on actual measurement
4. Prediction of early failure due to non-visual defect on time-dependent dielectric breakdown of low-k dielectrics: Experimental verification of a yield-reliability model
5. Highly reliable molecular-pore-stacking (MPS)/Cu interconnects using novel post-etching treatment (PET) for 28 nm-node and beyond.
6. Path-finding for integration of porous SiOCH films (k∼2.5) in system-LSIs.
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