Highly reliable molecular-pore-stacking (MPS)/Cu interconnects using novel post-etching treatment (PET) for 28 nm-node and beyond.

Details

Language :

English

ISBNs :

9781457705038

Database :

Complementary Index

Journal :

Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International

Publication Type :

Conference

Accession number :

80323954

Full Text :

https://doi.org/10.1109/IITC.2011.5940341