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© 2018, Blackwell Publishing Ltd. All rights reserved. We present a 350°C self-aligned dual-gate a-IGZO backplane technology with a monolithically integrated multi-layer high-temperature thin-film barrier for flexible AMOLED. Thin-film barrier properties and TFT technology are optimized on 320 x 352mm substrates, and demonstrated in a flexible QQVGA 100 ppi AMOLED display prototype. ispartof: pages:1577-1580 ispartof: Digest of Technical Papers - SID International Symposium vol:49 issue:1 pages:1577-1580 status: published

© (2017) by SID-the Society for Information Display. All rights reserved. We present a qHD (960×540 with 3 sub-pixels) top-emitting ‘AMOLED display with 340ppi resolution using a self-aligned (SA) IGZO TFT backplane on polyimidefoil with humidity barrier. The back plane process flow is based on a 7 layer photolithography process with a CD=4um. We implement a 2TIC pixel engine and use commercial source driver IC made for LTPS. By using IGZO TFT and leveraging the extremely low off-current, we can switch-offthe power to the source and gate driver while maintaining the image un-changed for several minutes We demonstrate that, depending on the image content, low-refresh operation yields reduction in power consumption of up to 50% compared to normal (continuous) operation. We show that with further increase in resolution, the power saving through state retention will be even more significant. ispartof: Journal of the Society for Information Display vol:25 issue:4 pages:222-228 status: published

Wireless sensor networks (WSN) are sophisticated systems that are used to gather data from an unreachable and remote environment. WSN consists of base station and hundred to thousands of sensor nodes. The main design issues in WSN include efficient energy management and network lifetime. Most of the approaches assume the nodes to be homogenous, however they can be heterogeneous. In this paper we take a realistic approach by considering heterogeneous networks. The clustering mechanism, location of base station and the routing process are crucial to elongate the lifetime of the sensor nodes. The clusters will be formed in different topologies depending on the sensor node deployment. The mobile base station, concept of budget to the sensor nodes and multi hop routing in a sensor network with heterogeneous nodes is used to make the network energy efficient and maximize the network lifetime. General Terms Wireless Sensor Networks, Heterogeneous Sensor Nodes, Mobile Base Stations.

We present a QVGA (320×240 with 3 sub-pixel) top-emitting AMOLED display with 250ppi resolution using a self-aligned (SA) IGZO TFT backplane on polyimide-foil with full barrier. The back plane process flow is based on a 7 layer photolithography process. The aperture ratio of the top-emitting OLEDs is approx. 80%. An integrated gate driver is shown that can be driven at operation speed equivalent to a 4k2k display at 100Hz.

In this study, we have compared the performance of self-aligned a-IGZO thin-film transistors (TFTs) whereby the source/drain (S/D) region's conductivity enhanced in three different ways, that is, using SiNx interlayer plasma (hydrogen diffusion), using calcium (Ca as reducing metal) and using argon plasma (changing the atomic ratio). All these TFTs show comparable characteristics such as field-effect mobility (μFE) of over 10.0 cm2/(V.s), sub-threshold slope (SS-1) of 0.5 V/decade, and current ratio (ION/IOFF) over 108. However, under negative-bias-illumination-stress (NBIS), all these TFTs showed strong degradation. We attributed this NBIS stability issue to the exposed S/D regions and changes in the conductivity of S/D contact regions. The hydrogen plasma-treated TFTs showed the worst NBIS characteristics. This is linked to increased hydrogen diffusion from the S/D contact regions to the channel. In this study, we observed that the negative-bias-illumination-stress stabilities of self-aligned a-IGZO thin-film transistors are strongly dependent upon the source/drain (S/D) region's direct exposure to stress light. Among few different techniques for S/D conductivity enhancements such as metal reduction (Ca metal), Ar plamsa, and SiNx plasma (hydrogen diffusion), the SiNx plasma-treated thin-film transistors showed the worst negative-bias-illumination-stress suitabilities. This is linked to increased hydrogen diffusion from the S/D contact regions to the channel. cop. 2015 Society for Information Display.

In this work we present the impact of buffer layers deposited by various techniques such as plasma enhanced chemical deposition (PECVD), physical vapor deposition (PVD) and atomic layer deposition (ALD) techniques on self-aligned (SA) top gate amorphous-Indium-Gallium-Zinc-Oxide (a-IGZO) TFT characteristics. Finally an optimized layer was integrated in TFT backplane on polyimide (PI) foil and a QQVGA AMOLED display is demonstrated.

In this work, we present the impact of S/D contact formation, that is, by SiN plasma doping (hydrogen incorporation), metallic reduction (by calcium) and by argon plasma (compositional change) on NBIS instabilities of self-aligned a-IGZO TFTs.

A process to make self-aligned top-gate amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) on polyimide foil is presented. The source/drain (S/D) region's parasitic resistance reduced during the SiN interlayer deposition step. The sheet resistivity of S/D region after exposure to SiN interlayer deposition decreased to 1.5 kΩ/□. TFTs show field-effect mobility of 12.0 cm2/(V.s), sub-threshold slope of 0.5 V/decade, and current ratio (I ON/OFF) of >107. The threshold voltage shifts of the TFTs were 0.5 V in positive (+1.0 MV/cm) bias direction and 1.5 V in negative (-1.0 MV/cm) bias direction after extended stressing time of 104 s. We achieve a stage-delay of ~19.6 ns at V-DD = 20 V measured in a 41-stage ring oscillator. A top-emitting quarter-quarter-video-graphics-array active-matrix organic light-emitting diode display with 85 ppi (pixels per inch) resolution has been realized using only five lithographic mask steps. For operation at 6 V supply voltage (V-DD), the brightness of the display exceeds 150 cd/m2. A process to make self-aligned top-gate amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) is presented. TFTs show field-effect mobility of 12.0 cm2/(V.s), sub-threshold slope of 0.5 V/decade, and current ratio (I ON/OFF) of over 107. In applications, a 41-stage ring oscillator with a stage-delay of ~19.6 ns (at V-DD = 20 V) and a top-emitting quarter-quarter-video-graphics-array (QQVGA) active-matrix organic light-emitting diode (AMOLED) display with 85 ppi (pixels per inch) resolution using five lithographic mask steps have been realized on a polyimide foil. Copyright 2015 Society for Information Display.

We present a QQVGA (160times120 with 3 sub-pixel) top-emitting AMOLED display with 85ppi resolution using a self-aligned (SA) IGZO TFT backplane on polyimide-foil. The back plane process flow is based on a 5 layer photolithography process. The aperture ratio of the top-emitting OLEDs is approx. 25%. For operation at 6 V supply voltage (VDD), the brightness of the display exceeds 150cd/m2. On the same substrate a 160 stage gate-driver was measured at FHD rate. cop. 2014 Society for Information Display.

In this work, we report on high-performance bottom-gate top-contact (BGTC) amorphous-Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) with SiO2 as an etch-stop-layer (ESL) deposited by medium frequency physical vapor deposition (mf-PVD). The TFTs show field-effect mobility (μFE) of 16.0cm2/(V.s), sub-threshold slope (SS -1) of 0.23V/decade and off-currents (IOFF)

In this study, we report high-quality amorphous indiunrv-galiium-zinc-oxide (a-IGZO) thinfilm transistors (TFTs) fabricated on a polyethylene naphthalate foil using a new back-channel-etch (BCE) process flow. The BCE flow allows a better scalability of TFTs for high-resolution backplanes and related circuits. The maximum processing temperature was limited to less than lôS'C in order to ensure good overiay accuracy (

In this study, the authors report on high-quality amorphous indium-galliunv-zinc oxide thinfilm transistors (TFTs) based on a single-source dual-layer concept processed at temperatures down to ISCC. The dual-layer concept allows the precise control of local charge carrier densities by varying the 02/Ar gas ratio during sputtering for the bottom and top layers. Therefore, extensive annealing steps after the deposition can be avoided. In addition, the dual-layer concept is more robust against variation of the oxygen flow in the deposition chamber. The charge carrier density in the TFT channel is namely adjusted by varying the thickness of the two layers whereby the oxygen concentration during deposition is switched only between no oxygen for the bottom layer and very high concentration for the top layer. The dual-layer TFTs are more stable under bias conditions in comparison with single-layer TFTs processed at low temperatures. Finally, the applicability of this dual-layer concept in logic circuitry such as 19-stage ring oscillators and a TFT backplane on polyethylene naphthalate foil containing a quarter video graphics array active-matrix organic lightemitting diode display demonstrator is proven.

We present a low-temperature metal oxide transistor backplane technology using PECVD dielectrics. We show successful integration of the backplane in flexible 200ppi AMOLED displays on ultrathin polymer films. The displays are encapsulated with a thin-film barrier and the total stack thickness is less than 150μm.

We present a top emitting monochrome AMOLED display with 85dpi resolution using an amorphous Indium-Gallium-Zinc-Oxide (IGZO) TFT backplane on PEN-foil. Maximum processing temperature was limited to 150 °C in order to ensure an overlay accuracy < 3μm on PEN foil. The backplane process flow is based on a 7 mask photolithography process that yields a final mobility of the IGZO TFTs of ∼ 13 cm2A/s.