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A new method for reducing the cost and the fabrication time of source material required for SiC crystal growth has been proposed through a heat treatment of recycled powder bulk in this study. The actual crystal growth with using a conventional powder and a recycled powder bulk source has been performed under identical growth condition and then systematically compared in terms of the crystal quality. With applying the recycled powder bulk for SiC crystal growth, similar growth results were obtained as a result grown by conventional high-purity powder source. In terms of crystal defects, slight improvement was observed when high purity recycled powder bulk source was applied.

A modified process condition has been proposed for the growth of high-quality 6-inch 4H-SiC single crystal. Temperature gradient (dT[°C] = Tbottom-Tupper) was controlled by changing coil position in order to investigate the effect of the temperature gradient on the SiC crystal quality. SiC ingot surface and etch pit density (EPD) of etched SiC wafer were investigated according to different dT conditions at the initial stage of SiC crystal growth. The surface of SiC crystal ingots grown with different dT for 10h were observed by OM and etched SiC wafers were prepared from SiC crystal ingots after main growth step for 100h. Different dT conditions in the initial growth stage resulted in dramatically different surface images and the crystal quality evaluated by EPD.

Transition metal ion was added to CMP (chemical-mechanical polishing) slurry without abrasive particle to solve the problem of CMP. MRR (material removal rate) value of SiC substrate processed using non-abrasive slurry was comparable to MRR values of SiC substrates using abrasive slurries. The scratch formation was successfully suppressed in SiC substrate polished with using non-abrasive slurry and no residual particle resulting from agglomeration of abrasive particles could suppress scratches and forms a good quality of SiC substrate surface. Uniform and high-quality SiC substrates could be prepared through the non-abrasive CMP process.