185 results on '"Mourier, T"'
Search Results
2. Contaminating viral sequences in high-throughput sequencing viromics: a linkage study of 700 sequencing libraries
3. 3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars
4. Conformal isolation of high-aspect-ratio TSVs using a low-κ dielectric deposited by filament-assisted CVD
5. The genome of the social amoeba Dictyostelium discoideum
6. An upgradable testing platform designed to characterize and test optical components of FMCW LiDARs, particularly optical phased arrays
7. Experimental measurements of electron scattering parameters in Cu narrow lines
8. Correlation between electromigration and Cu-contact angle after de-wetting
9. The genome of the simian and human malaria parasite Plasmodium knowlesi
10. Investigations of the interface stability in HfO 2–metal electrodes
11. Copper post-electroplating anneal: evaluation of in-line vs. furnace anneal on layer properties
12. Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures
13. Evaluation of (hfac)Cu(MHY) for Cu CVD
14. MobiSeq: De novo SNP discovery in model and non-model species through sequencing the flanking region of transposable elements
15. Modular and versatile characterization test bench for optical phased arrays
16. Surface treatment validation of inorganic BARC on 0.25 μm Non Volatile Memory technology
17. Paleomagnetic Rotations in the Coastal Areas of Ecuador and Northern Peru
18. Making Synchrotron Tomography a Routine Tool for 3D Integration Failure Analysis through a Limited Number of Projections, an Adapted Sample Preparation Scheme, and a Fully-Automated Post-Processing
19. Comparative genomics reveals insights into avian genome evolution and adaptation
20. High diversity of picornaviruses in rats from different continents revealed by deep sequencing
21. High-Resolution X-Ray Computed Tomography—What Synchrotron Sources Can Bring to 3Di Devices Failure Analysis
22. 3D integration for power MOS H bridge power application
23. Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
24. Chromerid genomes reveal the evolutionary path from photosynthetic algae to obligate intracellular parasites
25. Full 300 mm electrical characterization of 3D integration using High Aspect Ratio (10:1) mid-process through silicon vias
26. Electrografted Copper Seed Layer for High Aspect Ratio TSVs Interposer Metallization
27. Fifty thousand years of Arctic vegetation and megafaunal diet
28. SEM-based X-ray tomography of sub-micrometer defects in 3D integration
29. An upgradable testing platform designed to characterize and test optical components of FMCW LiDARs, particularly optical phased arrays.
30. Analysis of High Aspect Ratio through Silicon via (TSV) Diffusion and Stress Impact Profile during 3D Advanced Integration
31. The genome of the simian and human malaria parasite Plasmodium knowlesi
32. 3D Integration challenges today from technological toolbox to industrial prototypes
33. WSS and ZoneBOND temporary bonding techniques comparison for 80μm and 55μm functional interposer creation
34. The genome of the social amoeba Dictyostelium discoideum.
35. Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
36. Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process
37. Statistical Guidelines for Detecting Past Population Shifts Using Ancient DNA
38. LÉTI’S TWO STEP APPROACH IN THE DOMAIN OF 3D INTEGRATION
39. Retrotransposons and non-protein coding RNAs
40. Statistical evidence for miscoding lesions in ancient DNA templates
41. Materials and processes for high signal propagation performance and reliable 32 nm node BEOL
42. Reverse transcription in genome evolution
43. Ultra-fine pitch redistribution for 3D interposer.
44. Resist processes for hybrid (electron-beam/deep ultraviolet) lithography
45. 0.12 μm optical lithography performances using an alternating DUV phase shift mask
46. 0.12 /spl mu/m Optical Lithography Performance Using an Alternating DUV Phase Shift Mask
47. Modular and versatile characterization test bench for optical phased arrays.
48. 200 mm DUV Lithography : Material and Process Optimization Application to 0.25 μm CMOS Technology.
49. Deep UV Lithography for 0.35μm Design Rules Application to CMOS Technology with Three Metallization Levels.
50. Tertiary fission-track ages from the Bagua syncline (northern Peru): Stratigraphic and tectonic implications
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