1. Low-cost molded packaging for optical data links
- Author
-
Robinson, Steven D., Acarlar, M. Sabri, Chen, Yang C., Manzione, Louis T., Schevchuk, George J., and Stefanik, Dennis
- Subjects
Electronic packaging -- Research ,Transceivers -- Packaging ,Plastics -- Molding ,Business ,Engineering and manufacturing industries ,Science and technology - Abstract
The development of a molded-plastic packaging technology for optical data link transceivers is discussed. The technology, which integrates both optical and electrical components in a single package, was prototyped using design-for-simplicity techniques for an optical transceiver for fiber distributed data interface applications. It involves overmolding for sealing the package and aligning the optical ports as well as two-step transfer molding for internal shielding and intermediate integrated circuit testing.
- Published
- 1995