222 results on '"Mai, Z. H."'
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2. Excellent buffer layer for growing high-quality Y–Ba–Cu–O thin films
3. Deposition of crystal polythiophene thin films by KrF excimer laser ablation
4. Sharp Needles: Fabrication of Tungsten Nanotips by AC Electrochemical Etching and Laser Enhanced Etching for Nanoprobing on Interconnects of Advanced Technology Nodes.
5. Dependence of Lattice Constant on Layer Thickness of Pb(Zr0.52Ti0.48)O3 Thin Films
6. Structural properties of Pb(Zr0.53Ti0.47)O3/YBa2Cu3O7-δ heterostructures on SrTiO3 substrates
7. Different characteristics of high-temperature superconducting infrared detectors with granular and epitaxial films
8. Structural properties of Pb(Zr0.53Ti0.47)O3/YBa2Cu3O7−;δ heterostructures on SrTiO3 substrates
9. Characterization of GdBa2Cu3O7−x superconducting thin films by a new optical interference fringe method
10. X-ray and transmission electron microscopy analysis of imperfect Ge x Si1−x /Si strained-layer superlattices
11. Investigation on Laser-Induced Effects in Nanostructure Fabrication with Laser-Irradiated Scanning Tunneling Microscope Tips in Air Ambient
12. Thickness dependence of microstructures in La0.8Ca0.2MnO3 thin films.
13. Studies of the interfacial structure of LaAlO3 thin films on silicon by x-ray reflectivity and angle-resolved x-ray photoelectron spectroscopy.
14. Elemental distribution at the interfaces of NiMn/Co multilayers by x-ray anomalous scattering.
15. Electrochromic writing and erasing on tungsten oxide films in air by scanning tunneling microscopy.
16. Failure analysis methodology on center patch issue due to salicidation in wafer fab
17. High temperature nanoprobing application for SRAM soft failure fault isolation
18. Fault isolation on marginal failures using dummy signals
19. In situ TEM study of electron-beam radiation induced boron diffusion and effects on phase and microstructure evolution in nanostructured CoFeB/SiO2 thin film
20. X-ray analysis of strain relaxation in strained-layer superlattices.
21. X-ray diffraction analysis of Si1-xGex/Si superlattices.
22. X-ray reflectivity studies of the effect of surfactant on the growth of GeSi superlattices.
23. Magnetic properties of Fe/Pd multilayers grown by electron-beam evaporation.
24. Determination of surface roughness of InP (001) wafers by x-ray scattering.
25. Nanoprobing on the SRAM static noise margin (SNM) soft fail analysis
26. Detection of solder bump marginal contact resistance degradation using 4-point resistance measurement method
27. Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis
28. Chemical intermixing at FeMn/Co interfaces.
29. Electrical simulation on the localized NVM failed cell by AFP nanoproing
30. A sample preparation methodology to reduce sample edge unevenness and improve efficiency in delayering the 20-nm node IC chips
31. Application of atomic force probing on the polysilicon patterning issue
32. Effect of Microstructure on the Jc of YBa2Cu3O7-x Bulk Materials
33. X-ray analysis of ZnSe/ZnSTe quantum structure.
34. Interference effects in x-ray double-crystal rocking curves of GexSi1-x/Si superlattices.
35. Granular magnetoresistance ribbon material suitable for isotropic magnetic field transducers.
36. Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
37. Nanoprobing EBAC technique to reveal the failure root cause of gate oxide reliability issues of an IC process
38. Defect localization enhancement using light induced CI-AFP
39. Failure analysis methodology for the localization of thin and ultra-thin metal barrier residue
40. On-chip device and circuit diagnostics on advanced technology nodes by nanoprobing
41. Effective Utilization of STEM Imaging Capability in FIB for Physical Failure Analysis on 20nm & 14nm Transistor Nodes in Semiconductor Wafer Foundries
42. An Effective Approach to Extract Cross-Sectional Information from Top-Down SEM for 20nm & 14nm Transistor Nodes in Semiconductor Wafer-Foundries
43. Automated TEM Sample Preparation from Smaller Device Structure Regions of Semiconductor ICs using Inline Dual-Beam CLM+ and TEMLink 150
44. Strain measurement of Fin structure using TEM objective lens dark-field off-axis holography
45. TEM dark-field off-axis electron holography strain measurement on embedded-SiGe pMOSFETs and comparison with nano-beam diffraction strain measurement
46. Effectiveness of frequency mapping on 28 nm device broken scan chain failures
47. Optimization of AC Electrochemical Etching for Fabricating Tungsten Nanotips with Controlled Tip Profile
48. Sharpening Conical Tungsten Nanotips in KOH Solution under Laser Irradiation
49. Effect of strain on the transport and magnetoresistance properties of La0.8Ca0.2MnO3epitaxial thin films
50. Experimental evidence of the “dead layer” at Pt∕BaTiO3 interface
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