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To maintain high-quality semiconductor wafer production processes, it is necessary to build high-quality virtual metrology (VM) model. Based on the result of the VM, the engineer can monitor and control the specific process. In the manufacturing process, various sources are obtained from sensor equipment. It is important to consider that these source data exhibit varying characteristics during the model construction. However, when all data sources are simply aggregated into a single model, the performance of the overall model may degrade, especially if any of the individual sources contain outliers or noise. To address this issue, we develop a data-fusion model designed to incorporate diverse data sources into a unified multi-source model. In particular, we improve an Adaboost regression algorithm to make it suitable for multi-source data in the field of VM. The algorithm combines the residuals of the models derived from each individual data source and all sources to adaptively adjust the thresholding value, which, in turn, determines whether the predicted values are accurate or not for each weak learner. Extensive practical validations on real-world processing data from semiconductor manufacturers have demonstrated that the proposed method outperforms single learning algorithms and is more robust than all benchmarks. [ABSTRACT FROM AUTHOR]

Small angle x-ray scattering (SAXS) stands out as a promising solution in semiconductor metrology. The critical issue of SAXS metrology is to solve the SAXS inverse problem. With the increasing complexity of semiconductor devices, traditional strategies will face problems such as long iteration time and multiple solutions. To address these challenges, we develop a physical symmetry enhanced method to speed up the solution of the SAXS inverse problem for complex nanostructures. We incorporate the physical symmetry into a deep learning model, and a combined loss function is proposed to determine the correct structure in each step of training, which can continuously correct errors and make the model converge faster. The results show that the proposed method achieves high accuracy in determining the critical structural parameters of the complex profile gratings. Compared to traditional strategies, our method performs better in accuracy and does not require time-consuming iterations during reconstruction. The physical symmetry enhanced method provides a feasible way for achieving real-time reconstruction of complex profile nanostructures and is expected to promote the development of SAXS metrology. [ABSTRACT FROM AUTHOR]

In the semiconductor industry, virtual metrology (VM) is a cost-effective and efficient technique for monitoring the processes from one wafer to another. This technique is implemented by generating a predictive model that uses real-time data from equipment sensors in conjunction with measured wafer quality characteristics. Before establishing a prediction model for the VM system, appropriate selection of relevant input variables should be performed to maintain the efficiency of subsequent analyses considering the large dimensionality of the sensor data inputs. However, wafer production processes usually employ multiple sensors, which leads to cost escalations. Herein, we propose a variant of the sparse principal component analysis (PCA) called true sparse PCA (TSPCA). The proposed method uses a small number of input variables in the first few principal components. The main contribution of the proposed TSPCA is reducing the number of essential sensors. Our experimental results demonstrate that compared to the existing sparse PCA methods, the proposed approach can reduce the number of sensors required while explaining an approximately equivalent amount of variance. [ABSTRACT FROM AUTHOR]

In this work, we study the quantum Fisher information on the Heisenberg model in presence of the Dzyaloshinskii–Moriya interaction, basing on the multi-parametric estimation strategy in quantum metrology. First, we employ the density matrix vectorization method with a tool of the quantum Fisher information matrix through quantum Cramer–Rao bound. Second, we show that the multi-parameter quantum Cramer–Rao bound for simultaneous and individual estimation of the temperature and Dzyaloshinskii–Moriya interaction strongly relies on the concepts of the quantum Fisher information matrix. We confirm also the simultaneous strategy that provides a high precision than the individual. [ABSTRACT FROM AUTHOR]

Biomedical analytical applications, as well as the industrial production of high-quality nano- and sub-micrometre particles, require accurate methods to quantify the absolute number concentration of particles. In this context, small-angle x-ray scattering (SAXS) is a powerful tool to determine the particle size and concentration traceable to the Système international d'unités (SI). Therefore, absolute measurements of the scattering cross-section must be performed, which require precise knowledge of all experimental parameters, such as the electron density of solvent and particles, whereas the latter is often unknown. Within the present study, novel SAXS-based approaches to determine the size distribution, density and number concentrations of sub-micron spherical silica particles with narrow size distributions and mean diameters between 160 nm and 430 nm are presented. For the first-time traceable density and number concentration measurements of silica particles are presented and current challenges in SAXS measurements such as beam-smearing, poorly known electron densities and moderately polydisperse samples are addressed. In addition, and for comparison purpose, atomic force microscopy has been used for traceable measurements of the size distribution and single particle inductively coupled plasma mass spectrometry with the dynamic mass flow approach for the accurate quantification of the number concentrations of silica particles. The possibilities and limitations of the current approaches are critically discussed in this study. [ABSTRACT FROM AUTHOR]

Purpose: Lens power profiles can provide valuable insights on the imposed optical defocus and visual experience of contact lens wearers, especially in the context of myopia control. This study measured the refractive power profiles of multifocal soft contact lenses (MFCLs) currently used or that have the potential for use in myopia control using high spatial resolution aberrometry. The instrument's repeatability for determining MFCLs power profiles was also assessed. Method: The power profiles of 10 MFCLs of various designs (centre‐distance, centre‐near and extended depth of focus) were measured using the Lambda‐X NIMOEVO, a phase shifting Schlieren‐based device. Power profiles were graphically expressed as measured power at each chord position and the maximum add power was calculated. The repeatability of the NIMOEVO was expressed as the within‐subject standard deviation at each chord position for a subset of five MFCLs. Results: The measured distance powers differed from nominal powers for more than half of the MFCLs with a definable distance zone. There were variations in the chord position of the distance and near correction zones, rate of power transitions and calculated maximum add between the MFCLs which did not depend on lens design. For half of the MFCLs, the power profile shape was inconsistent between different nominal back vertex powers of the same design. The repeatability of the NIMOEVO was dependent on the lens design, with designs featuring faster rates of power change exhibiting worse repeatability. Conclusions: Significant differences in MFCL power profiles were found which were not adequately represented in labelling. This is likely due to the small number of parameters used to define lens power characteristics. Eye health care practitioners should be aware of potential differences in power profiles between different MFCLs, which will impact the retinal defocus introduced during lens wear and the wearer's visual experience. [ABSTRACT FROM AUTHOR]

Background: Stereo-DIC is a widely used optical measurement technique that provides a dense full-field 3D measurement of the shape, displacement, and strain of a solid sample. When compared with 2D-DIC, Stereo-DIC provides greater flexibility and expands its use beyond flat, planar specimens. Furthermore, the widespread availability of commercial systems has led to the adoption of the technique throughout industry, academia, and government research labs. Objective: Even though some research has been done to understand the effects of different experimental and stereo-DIC parameters, no reference is available to benchmark and compare the performance of current stereo-DIC algorithms to each other. Methods: This paper provides the description and analysis of a carefully controlled 3D experiment and associated images used to compare the results from five subset based DIC software packages. Both the images and analysis codes used in this paper to compare the results are described here and are available for download and use for continued research. Results: We show that over a very large range of motion, the 3D errors are very small, less than 80 μ m over a travel of ±20 mm out-of-plane and ±20 mm in-plane. While all codes performed similarly, there are important differences noted in the paper. Conclusion: The image sets and results comparison software are hosted by the International DIC Society (www.iDICs.org) and are freely available for download and analysis for comparison with results in this paper. Furthermore, it is hoped that this set of images can be used for future research in improving stereo-DIC by future authors. [ABSTRACT FROM AUTHOR]

Copyright of Technisches Messen is the property of De Gruyter and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Technisches Messen is the property of De Gruyter and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The pendant drop tensiometry is a preferred primary method for measuring interfacial tension (IFT) or surface tension. In a typical experimental setup, Gravitational pull opposes an interfacial tension forces to cause a liquid drop to develop into a pendant-like shape. The process comprises quantitatively modifying a theoretical profile generated through calculating the Young–Laplace capillarity formula to such an experimental pendant drop analysis and information by performing digital image analysis. However, specific parameters of this method lead to uncertainty in the obtained value of IFT. The present work aims to determine the role of factors such as evaporation of the hanging drop and its changing volume in interfacial tension, which is acting as major source of error in determining IFT of distilled water. This study details the measurement process and evaluation of standard errors with interfacial tension readings of distilled water by using pendant drop method with three calibrated needles of diameters, 0.9 mm (20 G), 1.27 mm (18 G) and 1.65 (16 G) mm. The needle's diameter influenced the evaporation rate and the value of IFT. Also, it is essential to consider these factors for further evaluating measurement uncertainties when determining the IFT of biological fluids. In addition, the present study makes an effort to determine the measurement error associated with drop volume and evaporation rate of drop in study. The distilled water used in the measurement had an absolute Interfacial tension of 72 mN/m, and the enlarged measurement errors were predicted to be in the range of 0.4–0.6%. It is critical to consider these associated measurement errors when determining the IFT of liquids for metrological application such as establishing primary standards for measurement pertaining to biological fluids. [ABSTRACT FROM AUTHOR]

Overlay (OVL) is one significant performance indicator for the lithography process control in semiconductor manufacturing. The accuracy of the OVL metrology is extremely critical for guarantee the lithography quality. Currently, diffraction-based overlay (DBO) is one of the mainstream OVL metrology techniques. Unfortunately, the accuracy of the DBO metrology is largely affected by the defect features of the OVL target. Therefore, there is a strong need to investigate the impacts of these target defects on the DBO metrology performance. However, efficiently investigating the statistical and interactive impacts of various DBO target defects remains challenging. This study aims to address this issue through proposing an intelligent sensitivity analysis approach. A cumulative distribution based global sensitivity analysis (GSA) method is utilized to assess the nonlinear influences of multiple defects in the OVL target on the DBO inaccuracy. The scenarios with both known and unknown distributions of the OVL target defects are considered. For the former, a neural network driven forward model is constructed for fast calculating the optical diffraction responses to accelerate the GSA process. For the latter, another neural network based inverse model are built for efficiently estimating the distribution of the target defects. Finally, a series of simulation experiments are conduct for typical DBO targets with multiple common defect features. The results demonstrate the effectiveness and robustness of the proposed approach as well as give valuable insights into the DBO defect analysis. Our study provides a strong tool to assist the practitioners in achieving intelligent and efficient DBO analysis and thus in enhancing OVL metrology performance. [ABSTRACT FROM AUTHOR]

Copyright of GeSec: Revista de Gestao e Secretariado is the property of Sindicato das Secretarias e Secretarios do Estado de Sao Paulo (SINSESP) and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

As manufacturing looks to employ more smart and autonomous processes to improve how items are made, reducing scrappage rates and with it the associated waste of time and energy, new ultra‐compact sensors are needed that can be deployed where existing instrumentation cannot. The use of traditional methods when constructing optical sensors limits the progress that can be made in reducing their size and weight, however, emerging technologies such as metasurfaces offer a platform by which these barriers can be overcome to develop the sensors needed to underpin this manufacturing transition. Here it is demonstrated that how a single metasurface can be used to deliver all the optical manipulations required to create a metasurface‐based confocal sensor with only the addition of a point source and point detector. By combining the optical functionality of both the illumination and the collection optics in this way the system is simplified and reduced in size significantly. While here how a metasurface can be used to reduce the number of elements needed to produce an ultra‐compact confocal sensor is demonstrated, this approach can be used to simplify a far wider range of instrumentation to greatly reduce their size and weight. [ABSTRACT FROM AUTHOR]

Quantum metrology promises unprecedented precision of parameter estimation, but it is often vulnerable to noise. While significant efforts have been devoted to improving the metrology performance in Markovian environments, practical control schemes specifically designed for non-Markovian noises are much less investigated. Here, we propose two control-enhanced quantum metrology schemes that are suitable for tackling general non-Markovian noises described by noise channels or noise spectra. We conduct experiments to verify the efficacy of these schemes on a nuclear magnetic resonance system. The experimental results involving multiqubit probes show that the parameter estimation precision can be greatly improved, significantly surpassing the standard quantum limit, with our schemes. At present, non-Markovian noises are widely encountered on diverse quantum devices, the proposed schemes are relevant for realistic metrology applications on these platforms. Quantum metrology, a powerful paradigm for surpassing classical measurement precision, has been extensively studied for Markovian noise, while most practical physical processes obey non-Markovian dynamics. In this paper, the authors propose control-enhanced quantum metrology schemes to counteract non-Markovian noise and experimentally verify their efficacy. [ABSTRACT FROM AUTHOR]

In this review, we summarize the latest advances in the design of optical frequency-domain reflectometers (OFDRs), digital signal processing, and sensors based on special optical fibers. We discuss state-of-the-art approaches to improving metrological characteristics, such as spatial resolution, SNR, dynamic range, and the accuracy of determining back reflection coefficients. We also analyze the latest achievements in the OFDR-based sensors: the accuracy of spatial localization of the impact, the error in detecting temperatures, deformation, and other quantities, and the features of separate measurement of various physical quantities. We also pay attention to the trend of mutual integration of frequency-domain optical reflectometry methods with time-domain optical reflectometry, which provides completely new sensing possibilities. We believe that this review may be useful to engineers and scientists focused on developing a lab setup, complete measurement instrument, or sensing system with specific requirements. [ABSTRACT FROM AUTHOR]

The article is dedicated to measuring the thickness of step height standards using the author's version of the variable wavelength interferometer (VAWI) in the reflected-light mode, where the interference pattern is created by the combination of two Wollaston prisms. The element of novelty consists in replacing the traditional search for the coincidence of fringes in the object and background with a continuous measurement of their periods and phases relative to the zero-order fringe. The resulting system of sinusoids is then analyzed using two methods: the classical one and the second utilizing the criterion of uniform thickness. The theory is followed by simulation and experimental parts, providing insight to the metrological potential of the VAWI technology. [ABSTRACT FROM AUTHOR]

The spin Hall effect of light, a phenomenon characterized by the transverse and spin dependent splitting of light at an optical interface, is highly promising for collecting precise quantitative data from interfaces and stands as an appealing option for improving precision metrology. This high level of precision is attributed to the principles of weak measurement. Since its conceptual introduction, the spin Hall effect of light has been empirically observed through weak measurement techniques, adhering closely to the initially proposed experimental configuration. Recently, it has been suggested that the setup can be downsized without compromising precision. Here, the first experimental demonstration of "compact weak measurement" is achieved by observing the spin Hall effect of both reflected and refracted light. Compared to the conventional weak measurement, this compact setup performs the same measurements but requires less free space by replacing the two convex lenses with a set of concave and convex lenses. The compact weak measurement demonstrates excellent agreement with theoretical predictions and experimental findings from traditional setups across both isotropic–isotropic and isotropic–anisotropic interfaces. The experimental validation of the compact configuration paves the way for the practical application of the spin Hall effect of light in devices with a smaller form factor. [ABSTRACT FROM AUTHOR]

Traditionally, for indoor radon testing, predominantly passive measurements have been used, typically applying the solid-state alpha track-etch method for long-term and the charcoal method for short-term measurements. However, increasingly, affordable consumer-grade active monitors have become available in the last few years, which can generate a concentration time series of an almost arbitrary duration. Firstly, we argue that consumer-grade monitors can well be used for quality-assured indoor radon assessment and consequent reliable decisions. Secondly, we discuss the requirements of quality assurance, which actually allow for reliable decision-making. In particular, as part of a rational strategy, we discuss how to interpret measurement results from low-cost active monitors with high and low sensitivity with respect to deciding on conformity with reference levels that are the annual average concentration of indoor radon. Rigorous analysis shows that temporal variations in radon are a major component of the uncertainty in decision-making, the reliability of which is practically independent of monitor sensitivity. Manufacturers of low-cost radon monitors already provide sufficient reliability and quality of calibration for their devices, which can be used by both professional inspectors and the general public. Therefore, within the suggested measurement strategy and metrologically assured criteria, we only propose to clarify the set and values of the key metrological characteristics of radon monitors as well as to upgrade user-friendly online tools. By implementing clear metrological requirements as well as the rational measurement strategy for the reliable conformity assessment of a room (building) with radon safety requirements, we anticipate significant reductions in testing costs, increased accessibility, and enhanced quality assurance and control (QA/QC) in indoor radon measurements. [ABSTRACT FROM AUTHOR]

Objective: The purpose of the present study was to assess the influence of color temperature and illuminance of ambient light on the accuracy of different intraoral scanners (IOSs) in complete‐arch implant scans. Methods: An edentulous model with six implants and scan bodies was digitized by using a laboratory scanner (DW‐7‐140; Dental Wings) to obtain a reference mesh. Fifteen scans were performed employing two intraoral scanners (Trios 4;3Shape A/S and i700; Medit Co) at two illuminances (500 and 1000 lux) and three color temperatures (3200, 4400, and 5600 K). Scanning accuracy was measured by using a 3D metrology software program (Geomagic Control X). Kruskal–Wallis, one‐way ANOVA, and pairwise comparison tests were used to analyze the data (α =.05). Results: Significant differences in trueness and precision values were found among the different IOSs under the same ambient lighting condition and among the different lighting conditions for a given IOS (p <.05) except for trueness in i700 groups (p >.05). Conclusions: The influence on the accuracy of color temperature and illuminance varied depending on the intraoral scanner. An optimal ambient scanning light condition was not found; this should be adjusted based on the specific IOS system used. 3200 K of ambient light influences the precision of i700 when performed at 1000 lux, decreasing the accuracy. The variation of color temperature at the same illuminance does not affect the scanning accuracy of TRIOS 4, which obtained better accuracy in all scans at 1000 lux. [ABSTRACT FROM AUTHOR]

Single-isotherm n(p, T90) results are reported for the gases Ar, N2, H2O, and D2O at vacuum wavelength λ = 1542.383 (1) nm. The argon and nitrogen isotherms were measured near 303 K; the water isotherms were measured near 373 K. Combined with the two previous articles of this series, the present results beget several insights via dispersion analyses. The argon result is highly consistent with static measurement plus ab initio calculation of dispersion polarizability. The nitrogen result is nominally consistent with one recent experiment and the dipole oscillator strength distributions, but the present work offers a refined estimate of the molar refractivity at optical wavelengths. For ordinary and heavy water, the dispersion trend is nominally consistent with existing liquid measurements. However, water's absorption features in the near-infrared preclude a reliable comparison of the present result with literature. [ABSTRACT FROM AUTHOR]

Polychlorinated biphenyls (PCBs) and polybrominated biphenyls (PBBs) are persistent organic pollutants still widespread in the environment and in the food chain. Both groups of these synthetic xenobiotics consist of 209 possible congeners depending on the number and position of halogens. PCBs with the same number of chlorine atoms and PBBs with the same number of bromine atoms are isomers: ten different degrees of halogenation are allowed, which results in a lot of existing isomers for both groups. The isomers have perfect correspondence in the number and type of atoms with differences only in positioning, so their mass spectra are expected to be identical with a consequent significant analytical problem in the event of coelution of the chromatographic peaks. This is not always the case, since the mass spectrometric ortho effect is capable of effectively discriminating many coeluting PCB or PBB isomers, although not all possible ones. The present paper investigates, for the first time, the reliability of qualitative and quantitative analysis by using the ortho effect: this was conducted through targeted experimental measurements on real samples of food by using different detectors. In this context, it is shown how to recognize the presence of a PCB that does not have the ortho effect when coeluting with an isomer that has. This is an important aspect that has never been studied until now. The ortho effect is extremely simple to operate once the ordinary GC-MS runs have been performed: the analyst only needs to recheck the mass spectrum for measuring the intensity of the first dehalogenation ion. The topic is of practical relevance since two different isomers can have different health hazards, and the presence of a very toxic isomer could be masked by a less toxic one. The same mass spectrometric ortho effect also deals with PXBs (i.e., mixed poly-brominated/chlorinated biphenyls), which are emerging contaminants. [ABSTRACT FROM AUTHOR]

Chronostratigraphy is the subfield of geology that studies the relative age of rock strata and that aims at producing a hierarchical classification of (global) divisions of the historical time-rock record. The 'golden spike' or 'GSSP' approach is the cornerstone of contemporary chronostratigraphic methodology. It is also perplexing. Chronostratigraphers define each global time-rock boundary extremely locally, often by driving a gold-colored pin into an exposed rock section at a particular level. Moreover, they usually avoid rock sections that show any meaningful sign of paleontological disruption or geological discontinuity: the less obvious the boundary, the better. It has been argued that we can make sense of this practice of marking boundaries by comparing the status and function of golden spikes to that of other concrete, particular reference standards from other sciences: holotypes from biological taxonomy and measurement prototypes from the metrology of weight and measures. Alisa Bokulich (2020b) has argued that these 'scientific types' are in an important sense one of a kind: they have a common status and function. I will argue that this picture of high-level conceptual unity is mistaken and fails to consider the diversity of aims and purposes of standardization and classification across the sciences. I develop an alternative, disunified account of scientific types that shows how differences in ontological attitudes and epistemic aims inform scientists' choices between different kinds of scientific types. This perspective on scientific types helps to make sense of an intriguing mid-twentieth-century debate among chronostratigraphers about the very nature of their enterprise. Should chronostratigraphers conventionally make boundaries by designating golden spikes, or should they attempt to mark pre-existing 'natural' boundaries with the help of a different kind of scientific type? [ABSTRACT FROM AUTHOR]

Psychometrics is historically grounded in the study of individual differences. Consequently, common metrics such as quantitative validity and reliability require between-person variance in a psychological variable to be meaningful. Experimental psychology, in contrast, deals with variance between treatments, and experiments often strive to minimise within-group person variance. In this article, I ask whether and how psychometric evaluation can be performed in experimental psychology. A commonly used strategy is to harness between-person variance in the treatment effect. Using simulated data, I show that this approach can be misleading when between-person variance is low, and in the face of methods variance. I argue that this situation is common in experimental psychology, because low between-person variance is desirable, and because methods variance is no more problematic in experimental settings than any other source of between-person variance. By relating validity and reliability with the corresponding concepts in measurement science outside psychology, I show how experiment-based calibration can serve to compare the psychometric quality of different measurement methods in experimental psychology. [ABSTRACT FROM AUTHOR]

This study models the temperature evolution during additive friction stir deposition (AFSD) using machine learning. AFSD is a solid-state additive manufacturing technology that deposits metal using plastic flow without melting. However, the ability to predict its performance using the underlying physics is in the early stage. A physics-informed machine learning approach, AFSD-Nets, is presented here to predict temperature profiles based on the combined effects of heat generation and heat transfer. The proposed AFSD-Nets includes a set of customized neural network approximators, which are used to model the coupled temperature evolution for the tool and build during multi-layer material deposition. Experiments are designed and performed using 7075 aluminum feedstock deposited on a substrate of the same material for 30 layers. A comparison of predictions and measurements shows that the proposed AFSD-Nets approach can accurately describe and predict the temperature evolution during the AFSD process. [ABSTRACT FROM AUTHOR]

This paper proposes a novel method for Virtual Metrology (VM) in plasma etch processes based on analysis of all time and wavelength samples of Optical Emission Spectroscopy (OES) signals. The new method flattens each OES signal into a single vector, after which Singular Value Decomposition (SVD) is performed on the matrix formed by vectors of flattened OES signals in the training dataset. Low rank SVD projections of flattened and standardized OES recordings served as inputs for Ridge Regression, Artificial Neural Network, and Random Forest based VM models. A VM study is then conducted on a dataset gathered from a major 300 mm wafer fabrication facility, showing that the use of newly proposed SVD-based OES features consistently outperformed benchmark VM model features. Additional analysis of feature importance performed based on the analytically tractable Ridge Regression VM model form demonstrated distinct time-frequency patterns of OES signal portions that were highly informative for prediction of relevant Critical Dimensions, clearly justifying the need to use the entire OES signals for VM. [ABSTRACT FROM AUTHOR]

Three dimensional Not-And (3D NAND) flash memory devices are scaling in the vertical direction to more than 200 oxide/sacrificial wordline nitride layers to further increase storage capacity and enhance energy efficiency. The accurate measurement of the thicknesses of these layers is critical to controlling stress-induced wafer warping and pattern distortion. While traditional optical metrology in the UV-vis-NIR range offers a non-destructive inline solution for high volume manufacturing, we demonstrate in this paper, that mid-IR metrology has advantages in de-correlating oxide and nitride thicknesses owing to their unique absorption signatures. Furthermore, because of the depths sensitivity of oxide and nitride absorptions, the simulated measurement results show the ability to differentiate thickness variations in the vertical zones. Good blind test results were obtained with a machine learning model trained on pseudo-references and pseudo spectra with added skew. [ABSTRACT FROM AUTHOR]

Virtual metrology (VM) is crucial for improving process capability and production yield during semiconductor manufacturing processes. However, the performance of VM deteriorates owing to the variable operating regime and the nonlinear characteristics of the process. Herein, Variational inference Gaussian mixture model (VIGMM) and extreme learning machine (ELM) are combined to solve these issues. First, variational inference is conducted on a Gaussian mixture model to determine the number of Gaussian components automatically and the corresponding operating regimes are identified. Subsequently, an extreme learning machine is developed for each operating regime to investigate the nonlinear relationship between process inputs and outputs. Finally, VM is implemented using the corresponding local ELM, which is determined based on the responsibility of the Gaussian components. The feasibility and effectiveness of the proposed methods are validated based on a numerical case and the plasma sputtering process for fabricating thin-film transistor liquid-crystal displays. The proposed VIGMM-ELM can serve as a VM algorithm for manufacturing processes with multiple stages. [ABSTRACT FROM AUTHOR]

A De-Pangher-type long counter was designed for neutron measurements in standard neutron fields based on the results of simulations using the MCNP6 code at the National Metrology Institute of Japan, the National Institute of Advanced Industrial Science and Technology. The effects of six parameters in the design on the energy response of the long counter were investigated. The energy response was then quantitatively evaluated for eight design candidates selected from the investigation. The calculation results show that these candidates have a flatter energy response from 100 eV to 10 MeV compared to that of the current long counter. These candidates also reduce the difference between the average energy response from 10 eV to 1 MeV and that from 10 to 20 MeV. [ABSTRACT FROM AUTHOR]

With the continued shrinking of the critical dimensions (CDs) of wafer patterning, the requirements for modeling precision in optical proximity correction (OPC) increase accordingly. This requirement extends beyond CD controlling accuracy to include pattern alignment accuracy because misalignment can lead to considerable overlay and metal-via coverage issues at advanced nodes, affecting process window and yield. This paper proposes an efficient OPC modeling approach that prioritizes pattern-shift-related elements to tackle the issue accurately. Our method integrates careful measurement selection, the implementation of pattern-shift-aware structures in design, and the manipulation of the cost function during model tuning to establish a robust model. Confirmatory experiments are performed on a via layer fabricated using a negative tone development. Results demonstrate that pattern shifts can be constrained within a range of ±1 nm, remarkably better than the original range of ±3 nm. Furthermore, simulations reveal notable differences between post OPC and original masks when considering pattern shifts at locations sensitive to this phenomenon. Experimental validation confirms the accuracy of the proposed modeling approach, and a firm consistency is observed between the simulation results and experimental data obtained from actual design structures. [ABSTRACT FROM AUTHOR]

The manipulation and metrology of light beams are pivotal for optical science and applications. In particular, achieving ultrahigh precision in the measurement of light beam rotations has been a long-standing challenge. Instead of using quantum probes like entangled photons, we address this challenge by incorporating a quantum strategy called "indefinite time direction" into the parameterizing process of quantum parameter estimation. Leveraging this quantum property of the parameterizing dynamics allows us to maximize the utilization of orbital angular momentum resources for measuring ultrasmall angular rotations of beam profile. Notably, a nanoradian-scale precision of light rotation measurement is lastly achieved in the experiment, which is the highest precision by far to our best knowledge. Furthermore, this scheme holds promise in various optical applications due to the diverse range of manipulable resources offered by photons. [ABSTRACT FROM AUTHOR]

The advent of the digital era has put forward an urgent need for the digitization of metrology, and the digitization of metrology vocabularies is one of the fundamental and critical steps to achieve the digital transformation of metrology. Metrology vocabulary ontology can facilitate the exchange and sharing of data and is an important way to achieve the digitization of metrology vocabulary. Time metrology vocabulary is a special and important part of the whole metrology vocabulary, and constructing its ontology can reduce the problems caused by semantic confusion, help to smooth the progress of metrological work, and promote the digital transformation of metrology. Currently, the existing ontology for metrology vocabulary is primarily the MetrOnto ontology, but it lacks a systematic description of the vocabulary of time metrology. To address this issue, improve the metrology vocabulary ontology, and lay the groundwork for realizing the digital transformation of metrology, this paper takes time metrology vocabulary as the research object; proposes a classification principle that meets the inherent requirements of time transfer in the digital world; adopts the seven-step method of ontology construction to construct an ontology specialized in time metrology vocabulary, OTMV (Ontology of Time Metrology Vocabulary); and conducts an ontology consistency check, a machine-readable validation, a machine-understandable primary validation, and information retrieval validation on it. The validation results show that OTMV has correct syntactic and logical consistency and is capable of realizing machine-readable, machine-understandable, and information retrieval. The construction of this ontology provides a systematic description of the time measurement vocabulary that can address the problem of word expression of time metrology vocabulary in the digital world and lay the foundation for the digitization of our metrology vocabulary, as well as its readability, understandability, and sharing. [ABSTRACT FROM AUTHOR]

We demonstrate that the contextuality of measurement selection can enhance the precision of quantum metrology with a simple linear optical experiment. Contextuality is a nonclassical property known as a resource for various quantum information processing tasks. Recent studies show that contextuality by anomalous weak values can be utilized to enhance metrological precision, unraveling the role of contextuality in quantum metrology. Our contextual quantum metrology (coQM) scheme can elevate the precision of the optical polarimetry as much as 6 times the precision limit given by the Quantum Fisher Information. We achieve the contextuality-enabled enhancement with two mutually complementary measurements, whereas, in the conventional method, some optimal measurements to achieve the precision limit are either theoretically challenging to find or experimentally infeasible to realize. These results highlight that the contextuality of measurement selection is applicable in practice for quantum metrology. [ABSTRACT FROM AUTHOR]

Purpose: This study aims to investigate the demoulding characteristics of material-jetted rapid mould inserts having different surface textures for micro-injection moulding using in-line measurements and surface metrology. Design/methodology/approach: Material-jetted inserts with the negative cavity of a circular test product were fabricated using different surface finishes and printing configurations, including glossy, matte and vertical settings. In-line measurements included the recording of demoulding forces at 10 kHz, which was necessary to capture the highly-dynamic characteristics. A robust data processing algorithm was used to extract reliable demoulding energies per moulding run. Thermal imaging captured surface temperatures on the inserts after demoulding. Off-line measurements, including focus variation microscopy and scanning electron microscopy, compared surface textures after a total of 60 moulding runs. Findings: A framework for capturing demoulding energies from material-jetted rapid tools was demonstrated and compared to the literature. Glossy surfaces resulted in significantly reduced demoulding forces compared to the industry standard steel moulds in the literature and their material-jetted counterparts. Minimal changes in the surface textures of the material-jetted inserts were found, which could potentially permit their prolonged usage. Significant correlations between surface temperatures and demoulding energies were demonstrated. Originality/value: The research presented here addresses the very topical issue of demoulding characteristics of soft, rapid tools, which affect the quality of prototyped products and tool durability. This was done using state-of-the-art, high-speed sensing technologies in conjunction with surface metrology and their durability for the first time in the literature. [ABSTRACT FROM AUTHOR]

This paper introduces a novel wafer-edge quality inspection method based on analysis of curved-edge diffractive fringe patterns, which occur when light is incident and diffracts around the wafer edge. The proposed method aims to identify various defect modes at the wafer edges, including particles, chipping, scratches, thin-film deposition, and hybrid defect cases. The diffraction patterns formed behind the wafer edge are influenced by various factors, including the edge geometry, topography, and the presence of defects. In this study, edge diffractive fringe patterns were obtained from two approaches: (1) a single photodiode collected curved-edge interferometric fringe patterns by scanning the wafer edge and (2) an imaging device coupled with an objective lens captured the fringe image. The first approach allowed the wafer apex characterization, while the second approach enabled simultaneous localization and characterization of wafer quality along two bevels and apex directions. The collected fringe patterns were analyzed by both statistical feature extraction and wavelet transform; corresponding features were also evaluated through logarithm approximation. In sum, both proposed wafer-edge inspection methods can effectively characterize various wafer-edge defect modes. Their potential lies in their applicability to online wafer metrology and inspection applications, thereby contributing to the advancement of wafer manufacturing processes. [ABSTRACT FROM AUTHOR]

In smart manufacturing, semiconductors play an indispensable role in collecting, processing, and analyzing data, ultimately enabling more agile and productive operations. Given the foundational importance of wafers, the purity of a wafer is essential to maintain the integrity of the overall semiconductor fabrication. This study proposes a novel automated visual inspection (AVI) framework for scrutinizing semiconductor wafers from scratch, capable of identifying defective wafers and pinpointing the location of defects through autonomous data annotation. Initially, this proposed methodology leveraged a texture analysis method known as gray-level co-occurrence matrix (GLCM) that categorized wafer images--captured via a stroboscopic imaging system--into distinct scenarios for high- and low-resolution wafer images. GLCM approaches further allowed for a complete separation of low-resolution wafer images into defective and normal wafer images, as well as the extraction of defect images from defective low-resolution wafer images, which were used for training a convolutional neural network (CNN) model. Consequently, the CNN model excelled in localizing defects on defective low-resolution wafer images, achieving an F1 score--the harmonic mean of precision and recall metrics--exceeding 90.1%. In high-resolution wafer images, a background subtraction technique represented defects as clusters of white points. The quantity of these white points determined the defectiveness and pinpointed locations of defects on high-resolution wafer images. Lastly, the CNN implementation further enhanced performance, robustness, and consistency irrespective of variations in the ratio of white point clusters. This technique demonstrated accuracy in localizing defects on high-resolution wafer images, yielding an F1 score greater than 99.3%. [ABSTRACT FROM AUTHOR]

This article introduces a novel hole edge inspection and metrology technology by edge diffractometry, which occurs when light interacts with the hole edge. The proposed method allows for simultaneous characterization of hole part error and edge roughness conditions. Edge diffraction occurs as light bends at a sharp edge. Such a diffractive fringe pattern, the so-called interferogram, is directly related to edge geometry and roughness. Image-based diffractometry inspection technology was developed to capture the diffractive fringe patterns. The collected fringe patterns were analyzed through statistical feature extraction methods, and numerical results such as roundness index, concentricity, and via edge roughness (VER) were obtained. The results indicated that hole 1 had an average VER of 0.665 µm and a roundness index of 0.95, while hole 2 was measured an average VER of 0.753 µm and a roundness index of 0.96. Through-focus scanning optical microscopy (TSOM) was also utilized to perform three-dimensional characterization of hole features along the depth direction. As a result, the proposed method could characterize hole part error and evaluate its roughness conditions. This study showed the potential to be adapted for automatic optical inspection for advancing microelectronics and semiconductor packaging technology. [ABSTRACT FROM AUTHOR]

Angular-dependent magneto-optical Kerr effect (MOKE) and coplanar waveguide ferromagnetic resonance (CPW-FMR) measurements were performed to unravel the nature of anisotropy present in Ni 80 Fe 20 (Py) thin film. The "in-plane" angular variation of coercive field ( H c IP ) and resonance field ( H r IP ) confirms the magnetic anisotropy is negligible, where the spins are confined to the plane of the Py film. The variation of resonance field in "out-of-plane" geometry, H r OP , strongly indicates the presence of "out-of-plane" uniaxial anisotropy in the Py thin film. Also, the inverse spin Hall effect (ISHE) technique is employed to measure spin pumping-induced DC voltage, V ISHE , generated across the Py/Pt bilayer. The line shape analysis method has been utilized to distinguish ISHE and spin rectification contributions. The measured V ISHE at low (4 GHz) and high (35 GHz) frequencies confirm the pure spin current injected through the Py-Pt interface due to spin pumping using CPW-FMR setup, which has a direct bearing on the realization of quantum metrology through the spin current quantity. [ABSTRACT FROM AUTHOR]

Metrology is the science of measurement and its applications, whereas biometrology is the science of biological measurement and its applications. Biometrology aims to achieve accuracy and consistency of biological measurements by focusing on the development of metrological traceability, biological reference measurement procedures, and reference materials. Irreproducibility of biological and multi-omics research results from different laboratories, platforms, and analysis methods is hampering the translation of research into clinical uses and can often be attributed to the lack of biologists' attention to the general principles of metrology. In this paper, the progresses of biometrology including metrology on nucleic acid, protein, and cell measurements and its impacts on the improvement of reliability and comparability in biological research are reviewed. Challenges in obtaining more reliable biological and multi-omics measurements due to the lack of primary reference measurement procedures and new standards for biological reference materials faced by biometrology are discussed. In the future, in addition to establishing reliable reference measurement procedures, developing reference materials from single or multiple parameters to multi-omics scale should be emphasized. Thinking in way of biometrology is warranted for facilitating the translation of high-throughput omics research into clinical practices. [ABSTRACT FROM AUTHOR]

Online inspection is one of the most critical processes of quality control in semiconductor manufacturing. The physical inspection methods for wafers are time-consuming and unable to achieve wafer level metrology. In order to improve production efficiency and expand inspection coverage, virtual metrology (VM) methods have recently received widespread attention; they utilize process parameters to estimate wafer metrology results. However, due to process drift and other reasons, the process information contained in real-time signal data (RTS data) used for VM modeling in industrial production is insufficient. This work proposed a hierarchical modeling method for machine learning-based virtual wafer metrology, leveraging RTS and post-process quality characteristics. The hierarchical model consists of an multiway principle analysis (MPCA) sub-model for RTS feature extracting and two separate long short-term memory (LSTM) networks for wafer-to-wafer dynamics in RTS and quality characteristics, respectively. A case study on the thickness VM of chemical vapor deposition thin film is conducted, and the proposed method has achieved better results than other methods in comparison. [ABSTRACT FROM AUTHOR]