46 results on '"Luoh, Tuung"'
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2. Improvement of the properties and electrical performance on TiCl 4-based TiN film using sequential flow chemical vapor deposition process
3. CMP Process Optimization Engineering by Machine Learning
4. Advanced CMP Process Control by Using Machine Learning Image Analysis
5. Advanced tungsten plug process for beyond nanometer technology
6. Inter-metal inorganic spin-on-glass dielectric layer in 100 nm generation technology
7. CMP Process Optimization Engineering by Machine Learning
8. Single-wafer polysilicon engineering for the improvement of over erase in a 0.18-[micro]m floating-gate flash memory
9. Process Optimization of Contact Module in NOR Flash Using High Resolution e-Beam Inspection
10. Verification of Systematic Defects Using e-Beam Defect Review System
11. Thermal stability enhancement of silicides by using N2 and Ar implantation
12. Dual gate oxide integrity improvement by implementing nitrogen implantation technology
13. Tungsten Gate Replacement Process Optimization in 3D NAND Memory
14. STI scratch defects reduction by using solid pad in 1X technology node
15. ANYSYS chip-level and wafer-level simulation on semiconductor process development — Yu-Chih Chang
16. Tungsten corrosion and recess improvement by feasible slurry and clean chemical in WCMP process
17. Overlay degradation induced by film stress
18. TiCl4 Barrier Process Engineering in Semiconductor Manufacturing
19. The new methodology of contact process window vericification
20. Capacity simulation by cellular automation in endura platform.
21. Systematic Hot Spots Finding By Pattern Search with Similarity
22. Dishing and erosion amount prediction according pattern density calculation algorithm in 3D design layout — Kuang-Wei Chen.
23. Dark field inspection technique on poly-silicon CMP process
24. The application of e beam inspection on 3D NAND flash
25. Sensitivities improvement by utilizing dark mode of bright filed inspection
26. FOUP environment control and condense reduction
27. Optics selection by high magnification optical micrograph in bright field inspection
28. Process Variation Improvement and Stress Analysis of Contact Module
29. Advanced Inspection Technique for High Aspect Ratio Contact Holes Using e Beam Scan and Voltage Cap in SEM Review
30. Overlay degradation induced by film stress
31. Yield enhancement using source/drain BF2+ implant process optimization
32. Improvement of the properties and electrical performance on TiCl4-based TiN film using sequential flow chemical vapor deposition process
33. A Novel Trapping-Nitride-Storage Non-Volatile Memory Cell Using a Gated-Diode Structure With an Ultra-Thin Dielectric Dopant Diffusion Barrier
34. Unipolar Switching Characteristics for Self-Aligned WOx Resistance RAM (R-RAM)
35. Virtual metrology for 3D vertical stacking processes in semiconductor manufacturing.
36. Observation of Recording Marks in Phase-Change Media Using Scanning Electron Microscopy Channelling Contrast lmage
37. Pattern damage and slurry behavior analysis of CMP process by mechanical and fluid simulations-Yi-Sheng Cheng.
38. Inspection sensitivity improvement by wafer sort failure sites matching algorithm — Chimin Chen.
39. Improvement of the properties and electrical performance on TiCl4-based TiN film using sequential flow chemical vapor deposition process
40. Thermal stability enhancement of silicides by using N2 and Ar implantation
41. 3D interconnect simulation applied to CMP thickness variations.
42. Tiny physical defects inspection by optimized EBI methodology.
43. FOUP mini-environment contaminants analysis in semiconductor manufacturing.
44. Verification of Systematic Defects Using e-Beam Defect Review System
45. Process Optimization of Contact Module in NOR Flash Using High Resolution e-Beam Inspection
46. Smart Review Sampling Methodology in Huge Inspection Results
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