172 results on '"Liu, Fuhan"'
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2. Electrochromic materials based on novel polymers containing triphenylamine units and benzo[c][1,2,5]thiadiazole units
3. Review of the Relocation of General Zhang Fei’s Temple in View of the Three Gorges Dam Project
4. 基于梯度掺杂晶体的激光器模式匹配研究
5. Soluble high coloration efficiency electrochromic polymers based on (N-phenyl)carbazole, triphenylamine and 9,9-dioctyl-9H-fluorene
6. Subregion Based Prediction of Residual States in Friction Stir Welding of Dissimilar Metals
7. Demonstration of Eight Metal Layer Redistribution on Glass Substrate with Fine Features and Microvia
8. First Demonstration of Die-embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications
9. A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers
10. Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications
11. Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications
12. Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications
13. Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications
14. Polymer waveguide photonic interconnect for multichip communications-based heterogeneous integration
15. Two-/Multi-Photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging
16. First Demonstration of Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Applications
17. Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates
18. Reliability Modeling of Micro-vias in High-Density Redistribution Layers
19. Transmission Lines on Alumina Ribbon Ceramic Substrate Material for 30 to 170 GHz Wireless Applications
20. Flexible and Ultra-Thin Glass Substrates for RF Applications
21. Design and optimization of photonic interconnect for heterogenous integration
22. Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging
23. Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study
24. Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics
25. Fabrication and reliability demonstration of 5μm redistribution layer using low-stress dielectric dry film
26. An overview of material options suitable for today's commercial millimeter wave designs
27. i-line UV lithography and sub-10-µm feature size package substrate technologies
28. Innovative Sub-5-$\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects
29. Packaging Approaches for mm Wave and Sub-THz Communication
30. Low-Cost 1-$\mu$ m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL
31. Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications
32. Fabrication and Reliability Demonstration of 3 µm Diameter Photo Vias at 15 µm Pitch in Thin Photosensitive Dielectric Dry Film for 2.5 D Glass Interposer Applications
33. Design and Demonstration of 1µm Low Resistance RDL Using Panel Scale Processes for High Performance Computing Applications
34. Low-Cost Non-TSV Based 3D Packaging Using Glass Panel Embedding (GPE) for Power-Efficient, High-Bandwidth Heterogeneous Integration
35. Next Generation of 2-7 Micron Ultra-Small Microvias for 2.5D Panel Redistribution Layer by Using Laser and Photolithography Technologies
36. Evaluation of Fine-Pitch Routing Capabilities of Advanced Dielectric Materials for High Speed Panel-RDL in 2.5D Interposer and Fan-Out Packages
37. Electrochromism of novel triphenylamine-containing polyamide polymers
38. First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications
39. Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications.
40. Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications
41. Miniaturized High-Performance Filters for 5G Small-Cell Applications
42. Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDL
43. Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large Packages
44. Co-integration of High-Bandwidth Photonic and Electronic RDL on 2.5D Glass Interposers Using Low Optical Absorption Photoimageable Dielectric Polymer
45. Reliability Studies of 5 µm Diameter Photo Vias with Daisy Chain Resistance Using Dry Film Photosensitive Dielectric Material
46. 2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages
47. Organic Damascene Process for 1.5- $\mu$m Panel-Scale Redistribution Layer Technology Using 5- $\mu$m-Thick Dry Film Photosensitive Dielectrics
48. First Demonstration of Silicon-Like >250 I/O Per mm Per Layer Multilayer RDL on Glass Panel Interposers by Embedded Photo-Trench and Fly Cut Planarization
49. An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out Packages
50. Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics
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