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Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications
- Source :
- Components, Packaging, and Manufacturing Technology, IEEE Transactions on; 2024, Vol. 14 Issue: 3 p437-444, 8p
- Publication Year :
- 2024
-
Abstract
- This article demonstrates ultra-compact, high-performance filters with footprint smaller than <inline-formula> <tex-math notation="LaTeX">${0.602}\lambda _{0} \times 0.125\lambda _{0}$ </tex-math></inline-formula>, operating in 39-GHz frequency band, on ultra-thin alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc. Bandpass filters (BPFs) with three topologies, i.e.,edge-coupled, hairpin, and interdigital, together with quasi-lumped elliptical low-pass filters (LPFs) are designed on 80-<inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula>-thick ARC substrates and fabricated using a semi-additive patterning (SAP) process. Characterized from 14 to 50 GHz using a vector network analyzer (VNA), filters on ARC exhibit excellent model-to-hardware correlation and outstanding performance with respect to passband insertion loss (IL), return loss, selectivity, and out-of-band rejection. Moreover, they depict a very flat group delay within the passband with a maximum variation up to 0.058 ns. Showing an IL less than 1.43- and 0.95-dB at the cut-off frequency and mid-band frequency, respectively, LPFs and BPFs demonstrate a size reduction of up to 93% and 86%, respectively, compared to their counterparts on other substrates, while outperforming them as well. These highly miniaturized, integrated filters with high <inline-formula> <tex-math notation="LaTeX">$Q$ </tex-math></inline-formula>-factor are best-suited for RF front-end modules (FEMs) and mobile handsets in 5G and millimeter-wave (mm-wave) frequency ranges, indicating the potential of ARC for such applications.
Details
- Language :
- English
- ISSN :
- 21563950 and 21563985
- Volume :
- 14
- Issue :
- 3
- Database :
- Supplemental Index
- Journal :
- Components, Packaging, and Manufacturing Technology, IEEE Transactions on
- Publication Type :
- Periodical
- Accession number :
- ejs66173987
- Full Text :
- https://doi.org/10.1109/TCPMT.2024.3370725