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Your search keyword '"Lin, Y.W."' showing total 154 results
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154 results on '"Lin, Y.W."'

26. Application of 'critical compositional difference' concept to the growth of low dislocation density (<10 to the power 4 / cm squared) In(sub x) Ga (sub 1-x) As (x < or = 0.5) on GaAs

Author

Krishnamoorthy, V., Lin, Y.W., and Park, R.M.

Subjects
Thin films, Multilayered -- Research, Gallium arsenide -- Research, Crystals -- Growth, Physics
Abstract

Low dislocation density and high In content were observed in an experiment to study the dislocation density and residual strain in multilayer epitaxial compositions of In x Ga1-x As layers of differing formation grown on GaAs substrates. The experiment employed cross-sectional transmission electron microscopy (XTEM) and high-resolution x-ray diffraction analysis. The multilayer epitaxial structures were successfully grown and resulted in low dislocation density and high In content.

Published
1992

34. Strain relaxation of GaNxAs(sub 1-x) on GaAs (OO1) grown by molecular-beam epitaxy

Author

Pan, Z., Wang, Y.T., Li, L.H., Wang, H., Wei, Z., Zhou, Z.Q., and Lin, Y.W.

Subjects
Semiconductors -- Research, Stress relaxation (Materials) -- Research, Thin films -- Research, Physics
Abstract

The strain relaxation of GaNxAs(sub 1-x) thin films have been studied through high-resolution x-ray diffraction and dynamical theory simulations. Results indicate a huge disparity in the critical thickness measured through x-ray diffraction and the values obtained with the Matthews and Blakeslee (MB) model. The strain relaxation also occurs earlier on the films than that obtained with the MB model. The layer thickness must be carefully controlled to obtain GaNAs films of good quality.

Published
1999

39. Electromigration in flip chip solder joints under extra high current density

Author

Lin, Y.W., Ke, J.H., Chuang, H.Y., Lai, Y.S., and Kao, C.R.

Subjects
Electric currents -- Measurement, Electrodiffusion -- Analysis, Solder and soldering -- Evaluation, Semiconductor device, Physics
Abstract

A study related to the electromigration in flip chip solder joints under extra high current density is performed under two experimental setup, one with a cooling module to keep the chip temperature constant and the other one without a cooling module, is presented. The results demonstrated that the cooling module is able to decouple the applied current density and the chip temperature.

Published
2010

40. Energy strategy for carbon dioxide emission reduction in Taiwan

Author

Shih, L.H., Wu, R.H., Huarng, F., and Lin, Y.W.

Subjects
Emissions (Pollution) -- Control, Carbon dioxide -- Control, Environmental services industry
Abstract

Byline: L.H. Shih, R.H. Wu, F. Huarng, Y.W. Lin A linear programming model is proposed to find the energy strategy for reducing carbon dioxide emission in Taiwan. Scenarios that include energy switching and energy conservation under different emission levels are considered, and the corresponding economic impacts are evaluated. Emissions from thirty-nine sectors are reduced by two major mechanisms. Energy switching is assumed to be induced by energy price change, whereas energy conservation is assumed only in the four most energy-intensive sectors. The results show the economic impact on gross domestic product under different energy scenarios. Appropriate energy strategies for carbon dioxide emission reduction could be implemented based on the scenario analysis.

Published
2009

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