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44 results on '"Lin, Pengrong"'

4. Hand Operation Ergonomics Study and Design of CCGA Grinding Process

Author

Liu, Haoting, Ge, Jianyue, Wang, Yuan, Wang, Shengjie, Lin, Pengrong, Yang, Shaohua, Wang, Duming, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Li, Yong, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Oneto, Luca, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zamboni, Walter, Series Editor, Zhang, Junjie James, Series Editor, Long, Shengzhao, editor, and Dhillon, Balbir S., editor

Published
2023
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7. Facial Action Unit Detection by Exploring the Weak Relationships Between AU Labels

Author

Tian, Mengke, Zhu, Hengliang, Wang, Yong, Cai, Yimao, Liu, Feng, Lin, Pengrong, Huang, Yingzhuo, Xie, Xiaochen, Akan, Ozgur, Editorial Board Member, Bellavista, Paolo, Editorial Board Member, Cao, Jiannong, Editorial Board Member, Coulson, Geoffrey, Editorial Board Member, Dressler, Falko, Editorial Board Member, Ferrari, Domenico, Editorial Board Member, Gerla, Mario, Editorial Board Member, Kobayashi, Hisashi, Editorial Board Member, Palazzo, Sergio, Editorial Board Member, Sahni, Sartaj, Editorial Board Member, Shen, Xuemin, Editorial Board Member, Stan, Mircea, Editorial Board Member, Jia, Xiaohua, Editorial Board Member, Zomaya, Albert Y., Editorial Board Member, Gao, Honghao, editor, Wang, Xinheng, editor, Wei, Wei, editor, and Dagiuklas, Tasos, editor

Published
2022
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17. U2D2PCB: Uncertainty-Aware Unsupervised Defect Detection on PCB Images Using Reconstructive and Discriminative Models

Author

Chen, Changlin, Wu, Qiman, Zhang, Jin, Xia, Haojie, Lin, Pengrong, Wang, Yong, Tian, Mengke, and Song, Rencheng

Abstract

The defect detection of printed circuit board (PCB) images faces challenges such as limited sample number, imbalanced sample types, and varying detection reliability. To address these issues, this article proposes an uncertainty-aware unsupervised detection model on PCB images, short for $\rm { U^{2}D^{2}}$ PCB. The proposed method uses two U-Net networks to serve as the reconstructive subnetwork and the discriminative subnetwork, respectively. The former one reconstructs defect-free PCB images from defective PCB images, while the latter segments the defects and evaluates the defects uncertainty with the concatenated inputs of the defective and reconstructed images. The $\mathbf { U^{2}D^{2}}$ PCB model is trained in an unsupervised manner with only defect-free images embedding with multiscale artificial defects. Experimental results on the public PCB defect dataset and DeepPCB dataset demonstrate the effectiveness of the proposed method. The mean average precision (mAP) is 99.29% on the PCB defect dataset, while it reaches 95.78% on the DeepPCB dataset. These results are competitive to those of state-of-the-art (SOTA) fully supervised methods. The findings of $\mathrm { U^{2}D^{2}}$ PCB highlight the potential significance of using unsupervised learning techniques for PCB defect detection.

Published
2024
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26. Effect of chip size on thermal fatigue of flip-chip bump

Author

Lu Feng, Yao Quanbin, Lin Pengrong, Cao Yusheng, and Zhao Wenzhong

Subjects
Cyclic stress, Materials science, Integrated circuit, Chip, law.invention, Stress (mechanics), chemistry.chemical_compound, Parylene, chemistry, law, visual_art, Soldering, Electronic component, visual_art.visual_art_medium, Composite material, Flip chip
Abstract

Due to miniaturization and high density of integrated circuits, bump solders are widely used in electronic industry for assembling electronic components on the connection of chip to substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by thermal fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the solder bumps. In this study, effects of chip size on thermal fatigue life of the solder bumps were investigated by experiments and elastic-plastic finite element analysis, comparing four sizes of flip-chip devices to summarize the effect of chip sizes on temperature and stress/strain distribution, it turns out that strain/stress of corner bump was increasing with the chip size, at the end, we proposed a method to enhance the thermal fatigue life of solder bumps by using Parylene to protect the solder bump, results showed that Parylene layer could improve the strain and stress distribution significantly.

Published
2018

32. Effect of Solder Volume on Shear Strength between Sn-3.0Ag-0.5Cu Solder and Cu Metallization

Author

Wang Qian, Lin Pengrong, Liang Le, Tian Yanhong, Yang Shihua, and Wang Chunqing

Subjects
Materials science, Shear (geology), Soldering, Ball grid array, Metallurgy, Shear force, Interphase, Grain boundary, Direct shear test, Composite material, Microstructure
Abstract

Shear behavior of Sn-3.0Ag-0.5Cu solder joints on ball grid array substrates was investigated with different solder volumes and shear speeds to study the solder volume effect on shear properties. Both solder volume and shear speed were found to have strong effect on the shear strength. The shear force decreases obviously with the decrease of the solder volume due to the significant decrease of loaded area, while the shear strength has reverse trend. The shear strength increases sharply with the decrease of solder volume as a result of the discrepancy of interfacial reaction and microstructure. And the shear strength increases rapidly with the increase in shear speed due to the limited grain boundaries or interphase boundaries sliding and dislocation movement. After the shear test, fracture surfaces were investigated by canning electron microscopy equipped with energy dispersed x ray and it was found that the fracture mode of as-reflowed solder joints was primary ball cut within the bulk solder near the interface with a ductile rupture. The results suggest that even if the solder shear tests showed the same fracture mechanism, solder volume still has great effect on the shear properties at different shear speeds.

Published
2007

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